STACKED SEMICONDUCTOR PACKAGE

A metal pattern for heat dissipation is formed on the backside of a second semiconductor substrate, the metal pattern being in contact with a first semiconductor element mounted on a semiconductor device adjacent to the backside. Vias are formed on the peripheries of semiconductor substrates, the vi...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	AKAHOSHI TOSHITAKA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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