NONDESTRUCTIVE RELIABILITY MONITORING METHOD FOR ADHESIVELY BONDED STRUCTURES WHOSE SENSITIVITY IS IMPROVED BY USING PIEZOELECTRIC OR CONDUCTIVE MATERIALS

A method is disclosed for testing bonded part integrity of bonded structures with increased sensitivity and in a nondestructive manner. The method includes the steps of: mixing a piezoelectric material or an electrically conductive material with an adhesive agent, curing the adhesive agent in betwee...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHIN, WOO SEOK, LEE, SEUNG MIN, KIM, BYUNG CHUL, KWON, JAE WOOK, HWANG, HUI YUN, LEE, DAI GIL
Format:	Patent
Sprache:	eng
Schlagworte:	ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
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