NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS

A heat resistant negative working photosensitive composition that comprises (a) one or more polybenzoxazole precursor polymers (I), wherein x is an integer from about 10 to about 1000, y is an integer from 0 to about 900 and (x+y) is about less then 1000; Ar1 is a tetravalent aromatic group, a tetra...

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Bibliographische Detailangaben
Hauptverfasser: RUSHKIN IL-»YA, WATERSON PAMELA J, NAIINI AHMAD A, HOPLA RICHARD, WEBER WILLIAM D, POWELL DAVID B
Format: Patent
Sprache:eng
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