B-STAGEABLE DIE ATTACH ADHESIVES

The present invention relates to b- stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry. The adhesive comprises a) a solid component...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	FORRAY DEBORAH D, LIU PUWEI, DELOS SANTOS BENEDICTO P
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to b- stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry. The adhesive comprises a) a solid component heat-curable at a first temperature, b) a liquid component, which is either heat-curable at a second temperature or curable upon exposure to radiation in the electromagnetic spectrum, and c) a heat cure catalyst for the solid curable component.