IMAGE SENSOR MODULE AND CAMERA MODULE PACKAGE THEREWITH

IMAGE SENSOR MODULE AND CAMERA MODULE PACKAGE THEREWITH

A camera module package includes an image sensor module that can be formed as a chip scale package (CSP) with a wire bonding structure. The image sensor module includes an image sensing device unit having an image sensing device, a pixel area part formed on a surface of the image sensing device, and...

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Hauptverfasser: JONG, HA CHEON, HWANG, SAN DUK, YOON, DONG HYUN, YOO, JUNG KANG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
SEMICONDUCTOR DEVICES
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creator JONG, HA CHEON
HWANG, SAN DUK
YOON, DONG HYUN
YOO, JUNG KANG
description A camera module package includes an image sensor module that can be formed as a chip scale package (CSP) with a wire bonding structure. The image sensor module includes an image sensing device unit having an image sensing device, a pixel area part formed on a surface of the image sensing device, and a device connecting pad formed on a surface of the image sensing device for electrically connecting to external devices; a circuit board to which the image sensing device unit is attached on one surface, to which a board connecting pad that is electrically connected to the image sensing device unit is formed on the other surface, and that contains holes corresponding to locations of the pixel area part and the device connecting pad; and a connecting unit for connecting the device connecting pad and the board connecting pad.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20050082759A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20050082759A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20050082759A3</originalsourceid><addsrcrecordid>eNrjZDD39HV0d1UIdvUL9g9S8PV3CfVxVXD0c1FwdvR1DXKEiQQ4OnuD1IV4uAa5hnuGePAwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUknjvICMDA1MDAwsjc1NLR2PiVAEAtMUoyw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>IMAGE SENSOR MODULE AND CAMERA MODULE PACKAGE THEREWITH</title><source>esp@cenet</source><creator>JONG, HA CHEON ; HWANG, SAN DUK ; YOON, DONG HYUN ; YOO, JUNG KANG</creator><creatorcontrib>JONG, HA CHEON ; HWANG, SAN DUK ; YOON, DONG HYUN ; YOO, JUNG KANG</creatorcontrib><description>A camera module package includes an image sensor module that can be formed as a chip scale package (CSP) with a wire bonding structure. The image sensor module includes an image sensing device unit having an image sensing device, a pixel area part formed on a surface of the image sensing device, and a device connecting pad formed on a surface of the image sensing device for electrically connecting to external devices; a circuit board to which the image sensing device unit is attached on one surface, to which a board connecting pad that is electrically connected to the image sensing device unit is formed on the other surface, and that contains holes corresponding to locations of the pixel area part and the device connecting pad; and a connecting unit for connecting the device connecting pad and the board connecting pad.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PICTORIAL COMMUNICATION, e.g. TELEVISION ; SEMICONDUCTOR DEVICES</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20050824&amp;DB=EPODOC&amp;CC=KR&amp;NR=20050082759A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20050824&amp;DB=EPODOC&amp;CC=KR&amp;NR=20050082759A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JONG, HA CHEON</creatorcontrib><creatorcontrib>HWANG, SAN DUK</creatorcontrib><creatorcontrib>YOON, DONG HYUN</creatorcontrib><creatorcontrib>YOO, JUNG KANG</creatorcontrib><title>IMAGE SENSOR MODULE AND CAMERA MODULE PACKAGE THEREWITH</title><description>A camera module package includes an image sensor module that can be formed as a chip scale package (CSP) with a wire bonding structure. The image sensor module includes an image sensing device unit having an image sensing device, a pixel area part formed on a surface of the image sensing device, and a device connecting pad formed on a surface of the image sensing device for electrically connecting to external devices; a circuit board to which the image sensing device unit is attached on one surface, to which a board connecting pad that is electrically connected to the image sensing device unit is formed on the other surface, and that contains holes corresponding to locations of the pixel area part and the device connecting pad; and a connecting unit for connecting the device connecting pad and the board connecting pad.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PICTORIAL COMMUNICATION, e.g. TELEVISION</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD39HV0d1UIdvUL9g9S8PV3CfVxVXD0c1FwdvR1DXKEiQQ4OnuD1IV4uAa5hnuGePAwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUknjvICMDA1MDAwsjc1NLR2PiVAEAtMUoyw</recordid><startdate>20050824</startdate><enddate>20050824</enddate><creator>JONG, HA CHEON</creator><creator>HWANG, SAN DUK</creator><creator>YOON, DONG HYUN</creator><creator>YOO, JUNG KANG</creator><scope>EVB</scope></search><sort><creationdate>20050824</creationdate><title>IMAGE SENSOR MODULE AND CAMERA MODULE PACKAGE THEREWITH</title><author>JONG, HA CHEON ; HWANG, SAN DUK ; YOON, DONG HYUN ; YOO, JUNG KANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20050082759A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PICTORIAL COMMUNICATION, e.g. TELEVISION</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>JONG, HA CHEON</creatorcontrib><creatorcontrib>HWANG, SAN DUK</creatorcontrib><creatorcontrib>YOON, DONG HYUN</creatorcontrib><creatorcontrib>YOO, JUNG KANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JONG, HA CHEON</au><au>HWANG, SAN DUK</au><au>YOON, DONG HYUN</au><au>YOO, JUNG KANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>IMAGE SENSOR MODULE AND CAMERA MODULE PACKAGE THEREWITH</title><date>2005-08-24</date><risdate>2005</risdate><abstract>A camera module package includes an image sensor module that can be formed as a chip scale package (CSP) with a wire bonding structure. The image sensor module includes an image sensing device unit having an image sensing device, a pixel area part formed on a surface of the image sensing device, and a device connecting pad formed on a surface of the image sensing device for electrically connecting to external devices; a circuit board to which the image sensing device unit is attached on one surface, to which a board connecting pad that is electrically connected to the image sensing device unit is formed on the other surface, and that contains holes corresponding to locations of the pixel area part and the device connecting pad; and a connecting unit for connecting the device connecting pad and the board connecting pad.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
SEMICONDUCTOR DEVICES
title IMAGE SENSOR MODULE AND CAMERA MODULE PACKAGE THEREWITH
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-15T04%3A21%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=JONG,%20HA%20CHEON&rft.date=2005-08-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20050082759A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true