THERMOSETTING RESIN COMPOSITION AND USE THEREOF TO PROVIDE GOOD THERMOSETTING PROPERTIES WITHOUT USE OF CURING ACCELERATOR AND TO REDUCE DISCOLORATION

PURPOSE: A thermosetting resin composition is provided to give good thermosetting properties without the use of a curing accelerator and to reduce the discoloration of a resin under conditions of high temperature or light with high energy for a long time. CONSTITUTION: The thermosetting resin compos...

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Bibliographische Detailangaben
Hauptverfasser:	IDENO, RYUJI, OKUO, MASAMI, KOYAMA, TAKESHI, MIBAE, SHIRO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PURPOSE: A thermosetting resin composition is provided to give good thermosetting properties without the use of a curing accelerator and to reduce the discoloration of a resin under conditions of high temperature or light with high energy for a long time. CONSTITUTION: The thermosetting resin composition comprises an epoxy-containing resin and a curing agent, wherein the curing agent is cyclohexanetricarboxylic acid and/or anhydrides thereof, and wherein the mixing ratio of the epoxy-containing resin to the curing agent is 0.1-3.0 as an equivalent ratio expressed as (X/2)Y, wherein X is the total equivalent number of carboxyl groups when an acidic anhydride group is estimated into 2 as the equivalent number of a carboxyl group, and a carboxyl group is estimated into 1 as the equivalent number of a carboxyl group, and Y is the number of epoxy groups in the resin.