COMBINATION CARD AND MANUFACTURING METHOD THEREOF FOR USING CONTACT OR CONTACTLESS TYPE

PURPOSE: A combination card and a manufacturing method thereof are provided to reinforce adhesive force and electric conductivity by inserting/adhering a convex contact point formed on a COB(Chip On Board) pad to an insertion groove formed on an antenna coil. CONSTITUTION: After sequentially layerin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHAE, U SEOK, YOO, JIN HO, CHAE, JONG HUN, KWON, SANG CHEOL
Format: Patent
Sprache:eng ; kor
Schlagworte:
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Beschreibung
Zusammenfassung:PURPOSE: A combination card and a manufacturing method thereof are provided to reinforce adhesive force and electric conductivity by inserting/adhering a convex contact point formed on a COB(Chip On Board) pad to an insertion groove formed on an antenna coil. CONSTITUTION: After sequentially layering a lower protecting layer(10), a lower printing layer(20), an antenna coil insertion layer(30), an upper printing layer(40), and an upper protecting layer(50), a card main body of a thin file is formed by pressing the layers. The groove(102) is formed to the card main body(100). The insertion groove(106) is punched at a part placing an antenna terminal(36) of the antenna coil(32) exposed through the insertion groove. A conductive adhesive(104) is coated on the insertion groove. A conductive convex contact point(68) is projected/formed at a position on a COB pad(64) of a chip module(60) facing the insertion groove. To insert the conductive convex contact point into the insertion groove, the chip module is inserted into the groove of the card main body. After applying/curing heat and pressure, the chip module is firmly adhered.