POLISHING PAD CONDITIONER FOR CMP APPARATUS, FOR CONDITIONING POLISHING PAD EVENLY

PURPOSE: A polishing pad conditioner for CMP apparatus is provided to perform a uniform conditioning operation on all regions of a polishing pad by controlling differently the operating force of a diamond disk on the polishing pad according to the radius direction of the polishing pad. CONSTITUTION:...

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Bibliographische Detailangaben

1. Verfasser:	JUNG, MYEONG JIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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