POLISHING PAD CONDITIONER FOR CMP APPARATUS, FOR CONDITIONING POLISHING PAD EVENLY

POLISHING PAD CONDITIONER FOR CMP APPARATUS, FOR CONDITIONING POLISHING PAD EVENLY

PURPOSE: A polishing pad conditioner for CMP apparatus is provided to perform a uniform conditioning operation on all regions of a polishing pad by controlling differently the operating force of a diamond disk on the polishing pad according to the radius direction of the polishing pad. CONSTITUTION:...

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1. Verfasser: JUNG, MYEONG JIN
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator JUNG, MYEONG JIN
description PURPOSE: A polishing pad conditioner for CMP apparatus is provided to perform a uniform conditioning operation on all regions of a polishing pad by controlling differently the operating force of a diamond disk on the polishing pad according to the radius direction of the polishing pad. CONSTITUTION: A diamond disk(41) is used for regenerating a surface of a polishing pad. The diamond disk is moved along the radius direction of the polishing pad in order to polish the polishing pad. A diamond disk holder(42) is used for supporting the diamond disk and is moved to upper and lower directions. The first and the second driving sources(43,45) are used for providing the driving force to the diamond disk in order to move the diamond disk to the upper and the lower directions.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20040078361A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20040078361A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20040078361A3</originalsourceid><addsrcrecordid>eNrjZAgK8PfxDPbw9HNXCHB0UXD293PxDPH093MNUnDzD1Jw9g1QcAwIcAxyDAkN1oEIwZSA9aDodg1z9fOJ5GFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BRgYGJgYG5hbGZoaOxsSpAgCQljB4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>POLISHING PAD CONDITIONER FOR CMP APPARATUS, FOR CONDITIONING POLISHING PAD EVENLY</title><source>esp@cenet</source><creator>JUNG, MYEONG JIN</creator><creatorcontrib>JUNG, MYEONG JIN</creatorcontrib><description>PURPOSE: A polishing pad conditioner for CMP apparatus is provided to perform a uniform conditioning operation on all regions of a polishing pad by controlling differently the operating force of a diamond disk on the polishing pad according to the radius direction of the polishing pad. CONSTITUTION: A diamond disk(41) is used for regenerating a surface of a polishing pad. The diamond disk is moved along the radius direction of the polishing pad in order to polish the polishing pad. A diamond disk holder(42) is used for supporting the diamond disk and is moved to upper and lower directions. The first and the second driving sources(43,45) are used for providing the driving force to the diamond disk in order to move the diamond disk to the upper and the lower directions.</description><edition>7</edition><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20040910&amp;DB=EPODOC&amp;CC=KR&amp;NR=20040078361A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20040910&amp;DB=EPODOC&amp;CC=KR&amp;NR=20040078361A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JUNG, MYEONG JIN</creatorcontrib><title>POLISHING PAD CONDITIONER FOR CMP APPARATUS, FOR CONDITIONING POLISHING PAD EVENLY</title><description>PURPOSE: A polishing pad conditioner for CMP apparatus is provided to perform a uniform conditioning operation on all regions of a polishing pad by controlling differently the operating force of a diamond disk on the polishing pad according to the radius direction of the polishing pad. CONSTITUTION: A diamond disk(41) is used for regenerating a surface of a polishing pad. The diamond disk is moved along the radius direction of the polishing pad in order to polish the polishing pad. A diamond disk holder(42) is used for supporting the diamond disk and is moved to upper and lower directions. The first and the second driving sources(43,45) are used for providing the driving force to the diamond disk in order to move the diamond disk to the upper and the lower directions.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgK8PfxDPbw9HNXCHB0UXD293PxDPH093MNUnDzD1Jw9g1QcAwIcAxyDAkN1oEIwZSA9aDodg1z9fOJ5GFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BRgYGJgYG5hbGZoaOxsSpAgCQljB4</recordid><startdate>20040910</startdate><enddate>20040910</enddate><creator>JUNG, MYEONG JIN</creator><scope>EVB</scope></search><sort><creationdate>20040910</creationdate><title>POLISHING PAD CONDITIONER FOR CMP APPARATUS, FOR CONDITIONING POLISHING PAD EVENLY</title><author>JUNG, MYEONG JIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20040078361A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2004</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>JUNG, MYEONG JIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JUNG, MYEONG JIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLISHING PAD CONDITIONER FOR CMP APPARATUS, FOR CONDITIONING POLISHING PAD EVENLY</title><date>2004-09-10</date><risdate>2004</risdate><abstract>PURPOSE: A polishing pad conditioner for CMP apparatus is provided to perform a uniform conditioning operation on all regions of a polishing pad by controlling differently the operating force of a diamond disk on the polishing pad according to the radius direction of the polishing pad. CONSTITUTION: A diamond disk(41) is used for regenerating a surface of a polishing pad. The diamond disk is moved along the radius direction of the polishing pad in order to polish the polishing pad. A diamond disk holder(42) is used for supporting the diamond disk and is moved to upper and lower directions. The first and the second driving sources(43,45) are used for providing the driving force to the diamond disk in order to move the diamond disk to the upper and the lower directions.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title POLISHING PAD CONDITIONER FOR CMP APPARATUS, FOR CONDITIONING POLISHING PAD EVENLY
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-01T01%3A06%3A20IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=JUNG,%20MYEONG%20JIN&rft.date=2004-09-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20040078361A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true