Optical module package of flip chip bonding and packaging method thereof

PURPOSE: A flip chip bonding optical module package is provided to reduce an electrical parasitic component generated by the length of a wire in a conventional wire bonding process by fabricating an optical module package through a flip chip bonding method. CONSTITUTION: An input/output pad(102) is...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MUN, JONG TAE, EOM, YONG SEONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS SEMICONDUCTOR DEVICES
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