CHEMICAL POLISHING AGENT FOR COPPER AND COPPER ALLOY
PURPOSE: A chemical polishing agent for copper and copper alloy is provided to remove scale off copper and copper alloy without causing environmental pollution. CONSTITUTION: In a chemical polishing agent for copper and copper alloy comprising 15 to 75 wt.% of hydrogen peroxide (H2O2); 1.5 to 10 wt....
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| creator | BYUN, SANG JO |
| description | PURPOSE: A chemical polishing agent for copper and copper alloy is provided to remove scale off copper and copper alloy without causing environmental pollution. CONSTITUTION: In a chemical polishing agent for copper and copper alloy comprising 15 to 75 wt.% of hydrogen peroxide (H2O2); 1.5 to 10 wt.% of sulfuric acid (H2SO4); 0.1 to 1 wt.% of nonionic surface active agent; and balance of water, the nonionic surface active agent is characterized by being selected from chemicals represented below. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20020069062A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20020069062A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20020069062A3</originalsourceid><addsrcrecordid>eNrjZDBx9nD19XR29FEI8PfxDPbw9HNXcHR39QtRcPMPUnD2DwhwDVJw9HOBM318_CN5GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakm8d5CRgQEQmVkamBk5GhOnCgBA4yfs</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CHEMICAL POLISHING AGENT FOR COPPER AND COPPER ALLOY</title><source>esp@cenet</source><creator>BYUN, SANG JO</creator><creatorcontrib>BYUN, SANG JO</creatorcontrib><description>PURPOSE: A chemical polishing agent for copper and copper alloy is provided to remove scale off copper and copper alloy without causing environmental pollution. CONSTITUTION: In a chemical polishing agent for copper and copper alloy comprising 15 to 75 wt.% of hydrogen peroxide (H2O2); 1.5 to 10 wt.% of sulfuric acid (H2SO4); 0.1 to 1 wt.% of nonionic surface active agent; and balance of water, the nonionic surface active agent is characterized by being selected from chemicals represented below.</description><edition>7</edition><language>eng ; kor</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020829&DB=EPODOC&CC=KR&NR=20020069062A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020829&DB=EPODOC&CC=KR&NR=20020069062A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BYUN, SANG JO</creatorcontrib><title>CHEMICAL POLISHING AGENT FOR COPPER AND COPPER ALLOY</title><description>PURPOSE: A chemical polishing agent for copper and copper alloy is provided to remove scale off copper and copper alloy without causing environmental pollution. CONSTITUTION: In a chemical polishing agent for copper and copper alloy comprising 15 to 75 wt.% of hydrogen peroxide (H2O2); 1.5 to 10 wt.% of sulfuric acid (H2SO4); 0.1 to 1 wt.% of nonionic surface active agent; and balance of water, the nonionic surface active agent is characterized by being selected from chemicals represented below.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBx9nD19XR29FEI8PfxDPbw9HNXcHR39QtRcPMPUnD2DwhwDVJw9HOBM318_CN5GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakm8d5CRgQEQmVkamBk5GhOnCgBA4yfs</recordid><startdate>20020829</startdate><enddate>20020829</enddate><creator>BYUN, SANG JO</creator><scope>EVB</scope></search><sort><creationdate>20020829</creationdate><title>CHEMICAL POLISHING AGENT FOR COPPER AND COPPER ALLOY</title><author>BYUN, SANG JO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20020069062A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2002</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><toplevel>online_resources</toplevel><creatorcontrib>BYUN, SANG JO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BYUN, SANG JO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CHEMICAL POLISHING AGENT FOR COPPER AND COPPER ALLOY</title><date>2002-08-29</date><risdate>2002</risdate><abstract>PURPOSE: A chemical polishing agent for copper and copper alloy is provided to remove scale off copper and copper alloy without causing environmental pollution. CONSTITUTION: In a chemical polishing agent for copper and copper alloy comprising 15 to 75 wt.% of hydrogen peroxide (H2O2); 1.5 to 10 wt.% of sulfuric acid (H2SO4); 0.1 to 1 wt.% of nonionic surface active agent; and balance of water, the nonionic surface active agent is characterized by being selected from chemicals represented below.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng ; kor |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE |
| title | CHEMICAL POLISHING AGENT FOR COPPER AND COPPER ALLOY |
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