Method for fabricating an air gap shallow trench isolation structure

PURPOSE: Provided is a method for manufacturing an STI(Shallow Trench Isolation) structure with an air gap formed by decomposing a polymer filler material through an air gap layer. CONSTITUTION: A pad layer(20) and a barrier layer(30) are formed on a substrate(10), the pad layers(20) are patterned s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ANG TINGONG, LIM VICTOR SENGKEONG, SEE ALEX, TEH YOUNG-WAY, SIEW YONG KONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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