Metal finishing apparatus and metal finishing method using the same

PURPOSE: A metal surface process apparatus and a metal surface process method using the same are provided to prevent the generation of sludge, thus reducing the rate of inferior goods, to continuously maintain the speed of grinding, and to effectively manage a plating solution. CONSTITUTION: The met...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HAN, MUN HO, PARK, SE CHEOL, JANG, BAE SUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTIONOF COMPOUNDS OR NON-METALS METALLURGY PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY ORREFINING OF METALS PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS SEMICONDUCTOR DEVICES
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