Metal finishing apparatus and metal finishing method using the same
PURPOSE: A metal surface process apparatus and a metal surface process method using the same are provided to prevent the generation of sludge, thus reducing the rate of inferior goods, to continuously maintain the speed of grinding, and to effectively manage a plating solution. CONSTITUTION: The met...
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| creator | HAN, MUN HO PARK, SE CHEOL JANG, BAE SUN |
| description | PURPOSE: A metal surface process apparatus and a metal surface process method using the same are provided to prevent the generation of sludge, thus reducing the rate of inferior goods, to continuously maintain the speed of grinding, and to effectively manage a plating solution. CONSTITUTION: The metal surface process apparatus comprises: an electro bath(21); an electrolyte(24) received in the electro bath; an anode plate(22) immersed in the electrolyte; a cathode plate(23) immersed in the electrolyte; and an isolation plate(200) installed between the anode plate and the cathode plate so as to selectively pass only predetermined ion molten in the electrolyte through its fine holes during the process of electrolysis.
금속표면처리장치와 이를 이용한 금속표면처리방법를 개시한다. 본 발명은 전해욕과, 전해욕내에 함유되는 전해질용액과, 전해질용액내에 담궈지는 양극판 및 음극판과, 양극판 및 음극판 사이에 설치되어 전해공정시 전해질용액내에 용해된 특정이온만 선택적으로 통과시키는 미세한 구멍이 형성된 격리판을 포함한다. |
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금속표면처리장치와 이를 이용한 금속표면처리방법를 개시한다. 본 발명은 전해욕과, 전해욕내에 함유되는 전해질용액과, 전해질용액내에 담궈지는 양극판 및 음극판과, 양극판 및 음극판 사이에 설치되어 전해공정시 전해질용액내에 용해된 특정이온만 선택적으로 통과시키는 미세한 구멍이 형성된 격리판을 포함한다.</description><edition>7</edition><language>eng ; kor</language><subject>APPARATUS THEREFOR ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTIONOF COMPOUNDS OR NON-METALS ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY ORREFINING OF METALS ; PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS ; SEMICONDUCTOR DEVICES</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020504&DB=EPODOC&CC=KR&NR=20020032782A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020504&DB=EPODOC&CC=KR&NR=20020032782A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HAN, MUN HO</creatorcontrib><creatorcontrib>PARK, SE CHEOL</creatorcontrib><creatorcontrib>JANG, BAE SUN</creatorcontrib><title>Metal finishing apparatus and metal finishing method using the same</title><description>PURPOSE: A metal surface process apparatus and a metal surface process method using the same are provided to prevent the generation of sludge, thus reducing the rate of inferior goods, to continuously maintain the speed of grinding, and to effectively manage a plating solution. CONSTITUTION: The metal surface process apparatus comprises: an electro bath(21); an electrolyte(24) received in the electro bath; an anode plate(22) immersed in the electrolyte; a cathode plate(23) immersed in the electrolyte; and an isolation plate(200) installed between the anode plate and the cathode plate so as to selectively pass only predetermined ion molten in the electrolyte through its fine holes during the process of electrolysis.
금속표면처리장치와 이를 이용한 금속표면처리방법를 개시한다. 본 발명은 전해욕과, 전해욕내에 함유되는 전해질용액과, 전해질용액내에 담궈지는 양극판 및 음극판과, 양극판 및 음극판 사이에 설치되어 전해공정시 전해질용액내에 용해된 특정이온만 선택적으로 통과시키는 미세한 구멍이 형성된 격리판을 포함한다.</description><subject>APPARATUS THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTIONOF COMPOUNDS OR NON-METALS</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY ORREFINING OF METALS</subject><subject>PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD2TS1JzFFIy8zLLM7IzEtXSCwoSCxKLCktVkjMS1HIRZMF8jPyUxRKi0GckoxUheLE3FQeBta0xJziVF4ozc2g7OYa4uyhm1qQH59aXJCYnJqXWhLvHWRkYABExkbmFkaOxsSpAgBAFzMw</recordid><startdate>20020504</startdate><enddate>20020504</enddate><creator>HAN, MUN HO</creator><creator>PARK, SE CHEOL</creator><creator>JANG, BAE SUN</creator><scope>EVB</scope></search><sort><creationdate>20020504</creationdate><title>Metal finishing apparatus and metal finishing method using the same</title><author>HAN, MUN HO ; PARK, SE CHEOL ; JANG, BAE SUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20020032782A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2002</creationdate><topic>APPARATUS THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTIONOF COMPOUNDS OR NON-METALS</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY ORREFINING OF METALS</topic><topic>PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HAN, MUN HO</creatorcontrib><creatorcontrib>PARK, SE CHEOL</creatorcontrib><creatorcontrib>JANG, BAE SUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HAN, MUN HO</au><au>PARK, SE CHEOL</au><au>JANG, BAE SUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Metal finishing apparatus and metal finishing method using the same</title><date>2002-05-04</date><risdate>2002</risdate><abstract>PURPOSE: A metal surface process apparatus and a metal surface process method using the same are provided to prevent the generation of sludge, thus reducing the rate of inferior goods, to continuously maintain the speed of grinding, and to effectively manage a plating solution. CONSTITUTION: The metal surface process apparatus comprises: an electro bath(21); an electrolyte(24) received in the electro bath; an anode plate(22) immersed in the electrolyte; a cathode plate(23) immersed in the electrolyte; and an isolation plate(200) installed between the anode plate and the cathode plate so as to selectively pass only predetermined ion molten in the electrolyte through its fine holes during the process of electrolysis.
금속표면처리장치와 이를 이용한 금속표면처리방법를 개시한다. 본 발명은 전해욕과, 전해욕내에 함유되는 전해질용액과, 전해질용액내에 담궈지는 양극판 및 음극판과, 양극판 및 음극판 사이에 설치되어 전해공정시 전해질용액내에 용해된 특정이온만 선택적으로 통과시키는 미세한 구멍이 형성된 격리판을 포함한다.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTIONOF COMPOUNDS OR NON-METALS METALLURGY PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY ORREFINING OF METALS PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS SEMICONDUCTOR DEVICES |
| title | Metal finishing apparatus and metal finishing method using the same |
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