SUBSTRATE PROCESSING DEVICE, METHOD OF HEATING SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PURPOSE: To provide a heating assembly which is used for rapid thermal processing a semiconductor substrate, hardly deteriorated in performance even when operated in a vacuum, and capable of keeping an optimal output in accordance with controlling a substrate temperature much better. CONSTITUTION: A...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JOHN M. AREND, MAHAWILI IMAD
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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