Multichip module and assembly-stacked package using the same

PURPOSE: A multi-package and a stacked package using the same are provided to reduce a thickness of a package body by forming a multi-chip package. CONSTITUTION: A printed circuit board(152) is used generally as a substrate(152) of a multi-chip package(100). A via hole is formed on the printed circu...

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Bibliographische Detailangaben

Hauptverfasser:	KIM, YEONG SU, SONG, YEONG JAE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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