VACUUM CHAMBER FOR METAL DEPOSITION
PURPOSE: A vacuum chamber for metal deposition is provided to prevent reduction of a life cycle of an ion gauge and deterioration of accuracy of vacuum indication, and decrease defects in the metal deposition process, thereby increasing a process reliability by simultaneously opening or closing a va...
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| creator | BYUN, DAE IL KIM, YEONG SEON |
| description | PURPOSE: A vacuum chamber for metal deposition is provided to prevent reduction of a life cycle of an ion gauge and deterioration of accuracy of vacuum indication, and decrease defects in the metal deposition process, thereby increasing a process reliability by simultaneously opening or closing a valve for an ion gauge together with a high vacuum valve between a body and a pump. CONSTITUTION: A vacuum chamber for metal deposition comprises a body (10) for securing a sealed inner space for metal deposition; a pump (20) which is continuously connected with an inner space of the body (10) through a high vacuum valve (30), thereby pumping to make the inner space of the body (10) be in a vacuum state; an ion gauge (40) for checking the vacuum state of the inner space of the body (10); and a valve (50) for the ion gauge which is installed between other partial area of side surface of the body (10) and the ion gauge (40), thereby protecting the ion gauge (40). The valve (50) for the ion gauge is interlocked to the high vacuum valve (30) so as to be driven along with it. A controlling signal of the high vacuum valve (30) is commonly impressed so that the valve (50) for the ion gauge is opened or closed along with the high vacuum valve (30). |
| format | Patent |
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CONSTITUTION: A vacuum chamber for metal deposition comprises a body (10) for securing a sealed inner space for metal deposition; a pump (20) which is continuously connected with an inner space of the body (10) through a high vacuum valve (30), thereby pumping to make the inner space of the body (10) be in a vacuum state; an ion gauge (40) for checking the vacuum state of the inner space of the body (10); and a valve (50) for the ion gauge which is installed between other partial area of side surface of the body (10) and the ion gauge (40), thereby protecting the ion gauge (40). The valve (50) for the ion gauge is interlocked to the high vacuum valve (30) so as to be driven along with it. A controlling signal of the high vacuum valve (30) is commonly impressed so that the valve (50) for the ion gauge is opened or closed along with the high vacuum valve (30).</description><edition>7</edition><language>eng ; kor</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2001</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010205&DB=EPODOC&CC=KR&NR=20010010010A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010205&DB=EPODOC&CC=KR&NR=20010010010A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BYUN, DAE IL</creatorcontrib><creatorcontrib>KIM, YEONG SEON</creatorcontrib><title>VACUUM CHAMBER FOR METAL DEPOSITION</title><description>PURPOSE: A vacuum chamber for metal deposition is provided to prevent reduction of a life cycle of an ion gauge and deterioration of accuracy of vacuum indication, and decrease defects in the metal deposition process, thereby increasing a process reliability by simultaneously opening or closing a valve for an ion gauge together with a high vacuum valve between a body and a pump. CONSTITUTION: A vacuum chamber for metal deposition comprises a body (10) for securing a sealed inner space for metal deposition; a pump (20) which is continuously connected with an inner space of the body (10) through a high vacuum valve (30), thereby pumping to make the inner space of the body (10) be in a vacuum state; an ion gauge (40) for checking the vacuum state of the inner space of the body (10); and a valve (50) for the ion gauge which is installed between other partial area of side surface of the body (10) and the ion gauge (40), thereby protecting the ion gauge (40). The valve (50) for the ion gauge is interlocked to the high vacuum valve (30) so as to be driven along with it. A controlling signal of the high vacuum valve (30) is commonly impressed so that the valve (50) for the ion gauge is opened or closed along with the high vacuum valve (30).</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2001</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAOc3QODfVVcPZw9HVyDVJw8w9S8HUNcfRRcHEN8A_2DPH09-NhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHeQUYGBoZQ5GhMnCoA1IUjSw</recordid><startdate>20010205</startdate><enddate>20010205</enddate><creator>BYUN, DAE IL</creator><creator>KIM, YEONG SEON</creator><scope>EVB</scope></search><sort><creationdate>20010205</creationdate><title>VACUUM CHAMBER FOR METAL DEPOSITION</title><author>BYUN, DAE IL ; KIM, YEONG SEON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20010010010A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2001</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>BYUN, DAE IL</creatorcontrib><creatorcontrib>KIM, YEONG SEON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BYUN, DAE IL</au><au>KIM, YEONG SEON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>VACUUM CHAMBER FOR METAL DEPOSITION</title><date>2001-02-05</date><risdate>2001</risdate><abstract>PURPOSE: A vacuum chamber for metal deposition is provided to prevent reduction of a life cycle of an ion gauge and deterioration of accuracy of vacuum indication, and decrease defects in the metal deposition process, thereby increasing a process reliability by simultaneously opening or closing a valve for an ion gauge together with a high vacuum valve between a body and a pump. CONSTITUTION: A vacuum chamber for metal deposition comprises a body (10) for securing a sealed inner space for metal deposition; a pump (20) which is continuously connected with an inner space of the body (10) through a high vacuum valve (30), thereby pumping to make the inner space of the body (10) be in a vacuum state; an ion gauge (40) for checking the vacuum state of the inner space of the body (10); and a valve (50) for the ion gauge which is installed between other partial area of side surface of the body (10) and the ion gauge (40), thereby protecting the ion gauge (40). The valve (50) for the ion gauge is interlocked to the high vacuum valve (30) so as to be driven along with it. A controlling signal of the high vacuum valve (30) is commonly impressed so that the valve (50) for the ion gauge is opened or closed along with the high vacuum valve (30).</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng ; kor |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | VACUUM CHAMBER FOR METAL DEPOSITION |
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