METHOD FOR FORMING WIRE OF SEMICONDUCTOR DEVICE

PURPOSE: A method for forming a wire of a semiconductor device is provided to prevent the signal delay by reducing the capacitance between wires. CONSTITUTION: The first insulation film(22) is formed on a semiconductor substrate(20) formed with a lower wiring layer(21). A sacrificial layer for expos...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHO, CHAN SEOP, LEE, TAE GUK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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