Manufacturing method of electrostatic chuck including porous filter
According to one embodiment of the present invention, provided is a method for manufacturing an electrostatic chuck, which includes the steps of: placing a base body inside the lower chamber; applying a bonding agent to the base body; attaching an adsorption plate to the base body to which the bondi...
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creator | KANG HAN BYEOL GO KWANG RO RYU KYENG BAEK CHOI BONG KYU IM DONG HYEOK |
description | According to one embodiment of the present invention, provided is a method for manufacturing an electrostatic chuck, which includes the steps of: placing a base body inside the lower chamber; applying a bonding agent to the base body; attaching an adsorption plate to the base body to which the bonding agent is applied; disposing a pad portion on the adsorption plate; covering the pad portion and the lower chamber with the upper chamber; and applying pressure to the pad portion through the upper chamber.
본 발명의 일 실시예에 따른 정전척의 제조 방법은 하부 챔버의 내측에 베이스 바디를 배치하는 단계와, 베이스 바디 상에 본딩제를 도포하는 단계와, 본딩제가 도포되는 베이스 바디 상에 흡착 플레이트를 부착시키는 단계와, 흡착 플레이트 상에 패드부를 배치하는 단계와, 상부 챔버로 패드부 및 하부 챔버를 커버하는 단계 및 상부 챔버를 통해 패드부에 압력을 가하는 단계를 포함할 수 있다. |
format | Patent |
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본 발명의 일 실시예에 따른 정전척의 제조 방법은 하부 챔버의 내측에 베이스 바디를 배치하는 단계와, 베이스 바디 상에 본딩제를 도포하는 단계와, 본딩제가 도포되는 베이스 바디 상에 흡착 플레이트를 부착시키는 단계와, 흡착 플레이트 상에 패드부를 배치하는 단계와, 상부 챔버로 패드부 및 하부 챔버를 커버하는 단계 및 상부 챔버를 통해 패드부에 압력을 가하는 단계를 포함할 수 있다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231023&DB=EPODOC&CC=KR&NR=102592339B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231023&DB=EPODOC&CC=KR&NR=102592339B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KANG HAN BYEOL</creatorcontrib><creatorcontrib>GO KWANG RO</creatorcontrib><creatorcontrib>RYU KYENG BAEK</creatorcontrib><creatorcontrib>CHOI BONG KYU</creatorcontrib><creatorcontrib>IM DONG HYEOK</creatorcontrib><title>Manufacturing method of electrostatic chuck including porous filter</title><description>According to one embodiment of the present invention, provided is a method for manufacturing an electrostatic chuck, which includes the steps of: placing a base body inside the lower chamber; applying a bonding agent to the base body; attaching an adsorption plate to the base body to which the bonding agent is applied; disposing a pad portion on the adsorption plate; covering the pad portion and the lower chamber with the upper chamber; and applying pressure to the pad portion through the upper chamber.
본 발명의 일 실시예에 따른 정전척의 제조 방법은 하부 챔버의 내측에 베이스 바디를 배치하는 단계와, 베이스 바디 상에 본딩제를 도포하는 단계와, 본딩제가 도포되는 베이스 바디 상에 흡착 플레이트를 부착시키는 단계와, 흡착 플레이트 상에 패드부를 배치하는 단계와, 상부 챔버로 패드부 및 하부 챔버를 커버하는 단계 및 상부 챔버를 통해 패드부에 압력을 가하는 단계를 포함할 수 있다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQANAsDqL-w4GzYBscurYogriIewnXiw2NuZDc_b8IfoDTW97aDHeX1DsULSG94E0y8wTsgSKhFK7iJCDgrLhASBh1-r7MhbWCD1GobM3Ku1hp93Nj9pfzc7geKPNINTukRDLeHs2xPXWttV3fN_a_9QGgSjQr</recordid><startdate>20231023</startdate><enddate>20231023</enddate><creator>KANG HAN BYEOL</creator><creator>GO KWANG RO</creator><creator>RYU KYENG BAEK</creator><creator>CHOI BONG KYU</creator><creator>IM DONG HYEOK</creator><scope>EVB</scope></search><sort><creationdate>20231023</creationdate><title>Manufacturing method of electrostatic chuck including porous filter</title><author>KANG HAN BYEOL ; GO KWANG RO ; RYU KYENG BAEK ; CHOI BONG KYU ; IM DONG HYEOK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR102592339BB13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KANG HAN BYEOL</creatorcontrib><creatorcontrib>GO KWANG RO</creatorcontrib><creatorcontrib>RYU KYENG BAEK</creatorcontrib><creatorcontrib>CHOI BONG KYU</creatorcontrib><creatorcontrib>IM DONG HYEOK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KANG HAN BYEOL</au><au>GO KWANG RO</au><au>RYU KYENG BAEK</au><au>CHOI BONG KYU</au><au>IM DONG HYEOK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Manufacturing method of electrostatic chuck including porous filter</title><date>2023-10-23</date><risdate>2023</risdate><abstract>According to one embodiment of the present invention, provided is a method for manufacturing an electrostatic chuck, which includes the steps of: placing a base body inside the lower chamber; applying a bonding agent to the base body; attaching an adsorption plate to the base body to which the bonding agent is applied; disposing a pad portion on the adsorption plate; covering the pad portion and the lower chamber with the upper chamber; and applying pressure to the pad portion through the upper chamber.
본 발명의 일 실시예에 따른 정전척의 제조 방법은 하부 챔버의 내측에 베이스 바디를 배치하는 단계와, 베이스 바디 상에 본딩제를 도포하는 단계와, 본딩제가 도포되는 베이스 바디 상에 흡착 플레이트를 부착시키는 단계와, 흡착 플레이트 상에 패드부를 배치하는 단계와, 상부 챔버로 패드부 및 하부 챔버를 커버하는 단계 및 상부 챔버를 통해 패드부에 압력을 가하는 단계를 포함할 수 있다.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Manufacturing method of electrostatic chuck including porous filter |
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