Anti-condensation mechanism for piping joints of semiconductor facilities anti-condensation system

The present invention relates to a condensation preventing device for a piping joining part of a semiconductor equipment, and a condensation preventing system. According to an embodiment of the present invention, in the piping joining part of a semiconductor equipment piping consisting of a double p...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM SEUNGGI, WOO DAEYEON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BLASTING ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING JOINTS OR FITTINGS FOR PIPES LIGHTING MEANS FOR THERMAL INSULATION IN GENERAL MECHANICAL ENGINEERING PIPES SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING THERMAL INSULATION IN GENERAL WEAPONS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!