Diamond Invalidation Machining System Using Ultrasonics
The present invention relates to a diamond drawing die processing system using ultrasonic waves. The diamond drawing die processing system using ultrasonic waves, as main components, comprises a rotating chuck unit (100), a needle unit (200), a polishing unit (300), a vision inspection unit (400), a...
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Format: | Patent |
Sprache: | eng ; kor |
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Zusammenfassung: | The present invention relates to a diamond drawing die processing system using ultrasonic waves. The diamond drawing die processing system using ultrasonic waves, as main components, comprises a rotating chuck unit (100), a needle unit (200), a polishing unit (300), a vision inspection unit (400), and a control unit (500). Accordingly, the ultrasonic machining process is performed by oscillating the needle unit and performing ultrasonic processing of a die hole in a die core, periodically extracting damage information including the angle and shape of the needle unit, and grinding the needle unit to a set angle and shape based on the damage information, so that the ultrasonic machining process can be performed continuously and precisely.
본 발명은 초음파를 이용한 다이아몬드 인발다이스 가공시스템에 관련되며, 이는 니들부를 발진하여 다이스코어에 다이스 홀을 초음파가공수행하면서 주기적으로 니들부의 각도 및 형상을 포함하는 손상정보를 추출하고, 손상정보를 기반으로 니들부를 설정된 각도 및 형상으로 연마하는 방식으로 초음파가공 공정을 연속적으로 정밀하게 수행할 수 있도록 회전척부(100), 니들부(200), 연마부(300), 비전검사부(400), 제어부(500)를 포함하여 주요 구성으로 한다. |
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