MICRONEEDLE ASSEMBLY

The present invention relates to a microneedle assembly which comprises: a mold having one or more concave parts on the upper surface and microneedles molded by being injected into the concave parts; and an applicator detachably coupled to the upper surface of the mold, wherein the applicator compri...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KANG BOKKI, KIM DONGHWAN, EUM JAEHONG, KANG YOONSIK, IM JIYEON, LEE BOOYONG
Format: Patent
Sprache:eng ; kor
Schlagworte:
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