ADHESIVE TAPE HAVING IMPROVED REPELLENCE RESISTANCE AND ADHESION AND METHOD FOR FABRICATING THE SAME

The present invention relates to adhesive tape having increased repellence resistance and a manufacturing method thereof to increase repellence resistance of adhesive tape having a porous layer and an adhesive layer. According to the present invention, the adhesive tape comprises a porous layer havi...

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Bibliographische Detailangaben
Hauptverfasser:	CHO YOUNG DONG, YANG JIN SEONG, KIM JI WON, HONG SANG HYUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to adhesive tape having increased repellence resistance and a manufacturing method thereof to increase repellence resistance of adhesive tape having a porous layer and an adhesive layer. According to the present invention, the adhesive tape comprises a porous layer having a porous structure and an adhesive layer coupled to at least one surface of the porous layer. The adhesive layer is formed from an adhesive composition comprising an acrylic copolymer having a number average molecular weight of 800,000 to 1,200,000, a rosin-based resin, a terpene-based resin, an isocyanate-based curing agent, and an epoxy-based curing agent. The adhesive composition comprises, with respect to 100 parts by weight of the acrylic copolymer: 1 to 10 parts by weight of the rosin-based resin; 1 to 10 parts by weight of the terpene-based resin; 0.2 to 0.4 parts by weight of the isocyanate-based curing agent; and 0.05 to 0.1 parts by weight of the epoxy curing agent. 개시된 점착 테이프는, 다공성 구조를 갖는 다공층 및 상기 다공층의 적어도 일면에 결합되는 점착층을 포함한다. 상기 점착층은, 수평균 분자량이 800,000 내지 1,200,000인 아크릴 공중합체, 로진계 수지, 테르펜계 수지, 이소시아네이트계 경화제 및 에폭시계 경화제를 포함하는 점착제 조성물로부터 형성된다. 상기 점착제 조성물은, 상기 아크릴 공중합체 100 중량부에 대하여, 상기 로진계 수지 1 내지 10 중량부, 상기 테르펜계 수지 1 내지 10 중량부, 상기 이소시아네이트계 경화제 0.2 내지 0.4 중량부 및 상기 에폭시계 경화제 0.05 내지 0.1 중량부를 포함한다.