LED METHOD FOR FORMING SEMICONDUCTOR LAYER FOR LIGHT EMITTING DEVICE ON SUBSTRATE AND SEMICONDUCTOR LIGHT DEVICE USING THEREOF

An objective of the present invention is to provide a method for forming a semiconductor layer for an LED and a semiconductor light-emitting device manufactured by the same which allow continuous epitaxial growth of GaN-based and GaAs-based materials with different crystal structures on a single waf...

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Hauptverfasser: PARK KWANG WOOK, CHAN SOO SHIN, JANG HYUN CHUL, JEHYUK CHOI, PARK HYEONG HO
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creator PARK KWANG WOOK
CHAN SOO SHIN
JANG HYUN CHUL
JEHYUK CHOI
PARK HYEONG HO
description An objective of the present invention is to provide a method for forming a semiconductor layer for an LED and a semiconductor light-emitting device manufactured by the same which allow continuous epitaxial growth of GaN-based and GaAs-based materials with different crystal structures on a single wafer. According to embodiments of the present invention, the method for forming a semiconductor layer for an LED forms a semiconductor layer for an LED on a joining substrate consisting of a lower layer, an insulation layer, and an upper layer, and comprises: a step of exposing the lower layer corresponding to a blue region and a green region; a step of forming a first buffer layer on the exposed lower layer; a step of exposing the first buffer layer corresponding to the blue region by removing an insulation film corresponding to the blue region after forming the insulation film on the first buffer layer; a step of growing a blue light-emitting layer on the exposed first buffer layer; a step of exposing the first buffer layer corresponding to the green region by removing the insulation film corresponding to the green region; a step of growing a green light-emitting layer on the exposed first buffer layer; a step of exposing the upper layer corresponding to a red region; and a step of growing a red light-emitting layer on a second buffer layer after forming the second buffer layer on the exposed upper layer. 본 발명의 실시예에 따른 LED용 반도체층 형성 방법은, 하부층/절연층/상부층으로 이루어진 접합 기판 상에 LED용 반도체층을 형성하는 방법으로, 청색 영역 및 녹색 영역에 해당하는 상기 하부층을 노출시키는 단계; 상기 노출된 하부층 상에 제1 버퍼층을 형성하는 단계; 상기 제1 버퍼층 상에 절연막을 형성한 후, 상기 청색 영역에 해당하는 상기 절연막을 제거함으로써, 상기 청색 영역에 해당하는 상기 제1 버퍼층을 노출시키는 단계; 상기 노출된 제1 버퍼층 상에 청색 발광층을 성장시키는 단계; 상기 녹색 영역에 해당하는 상기 절연막을 제거함으로써, 상기 녹색 영역에 해당하는 상기 제1 버퍼층을 노출시키는 단계; 상기 노출된 제1 버퍼층 상에 녹색 발광층을 성장시키는 단계; 적색 영역에 해당하는 상기 상부층을 노출시키는 단계; 및 상기 노출된 상부층 상에 제2 버퍼층을 형성한 후, 상기 제2 버퍼층 상에 적색 발광층을 성장시키는 단계를 포함한다.
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According to embodiments of the present invention, the method for forming a semiconductor layer for an LED forms a semiconductor layer for an LED on a joining substrate consisting of a lower layer, an insulation layer, and an upper layer, and comprises: a step of exposing the lower layer corresponding to a blue region and a green region; a step of forming a first buffer layer on the exposed lower layer; a step of exposing the first buffer layer corresponding to the blue region by removing an insulation film corresponding to the blue region after forming the insulation film on the first buffer layer; a step of growing a blue light-emitting layer on the exposed first buffer layer; a step of exposing the first buffer layer corresponding to the green region by removing the insulation film corresponding to the green region; a step of growing a green light-emitting layer on the exposed first buffer layer; a step of exposing the upper layer corresponding to a red region; and a step of growing a red light-emitting layer on a second buffer layer after forming the second buffer layer on the exposed upper layer. 본 발명의 실시예에 따른 LED용 반도체층 형성 방법은, 하부층/절연층/상부층으로 이루어진 접합 기판 상에 LED용 반도체층을 형성하는 방법으로, 청색 영역 및 녹색 영역에 해당하는 상기 하부층을 노출시키는 단계; 상기 노출된 하부층 상에 제1 버퍼층을 형성하는 단계; 상기 제1 버퍼층 상에 절연막을 형성한 후, 상기 청색 영역에 해당하는 상기 절연막을 제거함으로써, 상기 청색 영역에 해당하는 상기 제1 버퍼층을 노출시키는 단계; 상기 노출된 제1 버퍼층 상에 청색 발광층을 성장시키는 단계; 상기 녹색 영역에 해당하는 상기 절연막을 제거함으로써, 상기 녹색 영역에 해당하는 상기 제1 버퍼층을 노출시키는 단계; 상기 노출된 제1 버퍼층 상에 녹색 발광층을 성장시키는 단계; 적색 영역에 해당하는 상기 상부층을 노출시키는 단계; 및 상기 노출된 상부층 상에 제2 버퍼층을 형성한 후, 상기 제2 버퍼층 상에 적색 발광층을 성장시키는 단계를 포함한다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200616&amp;DB=EPODOC&amp;CC=KR&amp;NR=102123018B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200616&amp;DB=EPODOC&amp;CC=KR&amp;NR=102123018B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PARK KWANG WOOK</creatorcontrib><creatorcontrib>CHAN SOO SHIN</creatorcontrib><creatorcontrib>JANG HYUN CHUL</creatorcontrib><creatorcontrib>JEHYUK CHOI</creatorcontrib><creatorcontrib>PARK HYEONG HO</creatorcontrib><title>LED METHOD FOR FORMING SEMICONDUCTOR LAYER FOR LIGHT EMITTING DEVICE ON SUBSTRATE AND SEMICONDUCTOR LIGHT DEVICE USING THEREOF</title><description>An objective of the present invention is to provide a method for forming a semiconductor layer for an LED and a semiconductor light-emitting device manufactured by the same which allow continuous epitaxial growth of GaN-based and GaAs-based materials with different crystal structures on a single wafer. According to embodiments of the present invention, the method for forming a semiconductor layer for an LED forms a semiconductor layer for an LED on a joining substrate consisting of a lower layer, an insulation layer, and an upper layer, and comprises: a step of exposing the lower layer corresponding to a blue region and a green region; a step of forming a first buffer layer on the exposed lower layer; a step of exposing the first buffer layer corresponding to the blue region by removing an insulation film corresponding to the blue region after forming the insulation film on the first buffer layer; a step of growing a blue light-emitting layer on the exposed first buffer layer; a step of exposing the first buffer layer corresponding to the green region by removing the insulation film corresponding to the green region; a step of growing a green light-emitting layer on the exposed first buffer layer; a step of exposing the upper layer corresponding to a red region; and a step of growing a red light-emitting layer on a second buffer layer after forming the second buffer layer on the exposed upper layer. 본 발명의 실시예에 따른 LED용 반도체층 형성 방법은, 하부층/절연층/상부층으로 이루어진 접합 기판 상에 LED용 반도체층을 형성하는 방법으로, 청색 영역 및 녹색 영역에 해당하는 상기 하부층을 노출시키는 단계; 상기 노출된 하부층 상에 제1 버퍼층을 형성하는 단계; 상기 제1 버퍼층 상에 절연막을 형성한 후, 상기 청색 영역에 해당하는 상기 절연막을 제거함으로써, 상기 청색 영역에 해당하는 상기 제1 버퍼층을 노출시키는 단계; 상기 노출된 제1 버퍼층 상에 청색 발광층을 성장시키는 단계; 상기 녹색 영역에 해당하는 상기 절연막을 제거함으로써, 상기 녹색 영역에 해당하는 상기 제1 버퍼층을 노출시키는 단계; 상기 노출된 제1 버퍼층 상에 녹색 발광층을 성장시키는 단계; 적색 영역에 해당하는 상기 상부층을 노출시키는 단계; 및 상기 노출된 상부층 상에 제2 버퍼층을 형성한 후, 상기 제2 버퍼층 상에 적색 발광층을 성장시키는 단계를 포함한다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi7EKwjAURbs4iPoPD5yFpl1c2-SlCaYJJK8Fp1IkTqKFOvvttqWTk8Plwr3nbJOPQQE1knICpPNzam0rCFhr7qxoOE2rKa64fGB0pQimk2jGBLaaIzgLoSkD-YIQCit-9UVa2SbMIin06OQ-2dz7xxgPa--So0Ti6hSHVxfHob_FZ3x3F8_SjGV5ys5lyfL_qC_jzzyP</recordid><startdate>20200616</startdate><enddate>20200616</enddate><creator>PARK KWANG WOOK</creator><creator>CHAN SOO SHIN</creator><creator>JANG HYUN CHUL</creator><creator>JEHYUK CHOI</creator><creator>PARK HYEONG HO</creator><scope>EVB</scope></search><sort><creationdate>20200616</creationdate><title>LED METHOD FOR FORMING SEMICONDUCTOR LAYER FOR LIGHT EMITTING DEVICE ON SUBSTRATE AND SEMICONDUCTOR LIGHT DEVICE USING THEREOF</title><author>PARK KWANG WOOK ; CHAN SOO SHIN ; JANG HYUN CHUL ; JEHYUK CHOI ; PARK HYEONG HO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR102123018BB13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>PARK KWANG WOOK</creatorcontrib><creatorcontrib>CHAN SOO SHIN</creatorcontrib><creatorcontrib>JANG HYUN CHUL</creatorcontrib><creatorcontrib>JEHYUK CHOI</creatorcontrib><creatorcontrib>PARK HYEONG HO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PARK KWANG WOOK</au><au>CHAN SOO SHIN</au><au>JANG HYUN CHUL</au><au>JEHYUK CHOI</au><au>PARK HYEONG HO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LED METHOD FOR FORMING SEMICONDUCTOR LAYER FOR LIGHT EMITTING DEVICE ON SUBSTRATE AND SEMICONDUCTOR LIGHT DEVICE USING THEREOF</title><date>2020-06-16</date><risdate>2020</risdate><abstract>An objective of the present invention is to provide a method for forming a semiconductor layer for an LED and a semiconductor light-emitting device manufactured by the same which allow continuous epitaxial growth of GaN-based and GaAs-based materials with different crystal structures on a single wafer. According to embodiments of the present invention, the method for forming a semiconductor layer for an LED forms a semiconductor layer for an LED on a joining substrate consisting of a lower layer, an insulation layer, and an upper layer, and comprises: a step of exposing the lower layer corresponding to a blue region and a green region; a step of forming a first buffer layer on the exposed lower layer; a step of exposing the first buffer layer corresponding to the blue region by removing an insulation film corresponding to the blue region after forming the insulation film on the first buffer layer; a step of growing a blue light-emitting layer on the exposed first buffer layer; a step of exposing the first buffer layer corresponding to the green region by removing the insulation film corresponding to the green region; a step of growing a green light-emitting layer on the exposed first buffer layer; a step of exposing the upper layer corresponding to a red region; and a step of growing a red light-emitting layer on a second buffer layer after forming the second buffer layer on the exposed upper layer. 본 발명의 실시예에 따른 LED용 반도체층 형성 방법은, 하부층/절연층/상부층으로 이루어진 접합 기판 상에 LED용 반도체층을 형성하는 방법으로, 청색 영역 및 녹색 영역에 해당하는 상기 하부층을 노출시키는 단계; 상기 노출된 하부층 상에 제1 버퍼층을 형성하는 단계; 상기 제1 버퍼층 상에 절연막을 형성한 후, 상기 청색 영역에 해당하는 상기 절연막을 제거함으로써, 상기 청색 영역에 해당하는 상기 제1 버퍼층을 노출시키는 단계; 상기 노출된 제1 버퍼층 상에 청색 발광층을 성장시키는 단계; 상기 녹색 영역에 해당하는 상기 절연막을 제거함으로써, 상기 녹색 영역에 해당하는 상기 제1 버퍼층을 노출시키는 단계; 상기 노출된 제1 버퍼층 상에 녹색 발광층을 성장시키는 단계; 적색 영역에 해당하는 상기 상부층을 노출시키는 단계; 및 상기 노출된 상부층 상에 제2 버퍼층을 형성한 후, 상기 제2 버퍼층 상에 적색 발광층을 성장시키는 단계를 포함한다.</abstract><oa>free_for_read</oa></addata></record>
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ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title LED METHOD FOR FORMING SEMICONDUCTOR LAYER FOR LIGHT EMITTING DEVICE ON SUBSTRATE AND SEMICONDUCTOR LIGHT DEVICE USING THEREOF
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