Apparatus and Method for treating substrate

The present invention relates to a device and a method for processing a substrate, and more specifically, to a device and a method for removing a film formed on a substrate. The method for processing the substrate comprises: a primary solvent supply step of removing a photosensitive film on a substr...

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Bibliographische Detailangaben
Hauptverfasser:	HONG JISU, CHOI MOONSIK, KWON OH JIN, KIM SUN MI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention relates to a device and a method for processing a substrate, and more specifically, to a device and a method for removing a film formed on a substrate. The method for processing the substrate comprises: a primary solvent supply step of removing a photosensitive film on a substrate by supplying an organic solvent on the substrate; and an ozone supply step of supplying a liquid including ozone to the substrate to remove residual organic materials on the substrate after the primary solvent supply step. Since the organic solvent is used to remove the film, it is possible to lower the burden of cost and the environmental inhibition compared to chemicals of strong acids. 본 발명은 기판 상에 형성된 막을 제거하는 장치 및 방법을 제공한다. 기판을 처리하는 방법은 상기 기판 상에 유기 용제를 공급하여 상기 기판 상의 감광막을 제거하는 1차 용제 공급 단계 및 상기 1차 용제 공급 단계 이후에, 상기 기판에 오존을 포함하는 액을 공급하여 상기 기판 상에 잔류 유기물을 제거하는 오존 공급 단계를 포함한다. 막 제거에 유기 용제가 사용되므로, 강산의 케미칼에 비해 비용 부담 및 환경 저해성을 낮출 수 있다.