A manufacturing method of oral sensor using print circuit board of build-up multi layer
According to the present invention, a multi-layer printed circuit board comprises: a plurality of laminated plates having one or more through holes; and one or more coupling pins inserted into the through hole and connecting the plurality of laminated plates. The present invention can miniaturize a...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; kor |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | OH GUEN YOUNG HONG SAM PYO YANG JIN GYU |
| description | According to the present invention, a multi-layer printed circuit board comprises: a plurality of laminated plates having one or more through holes; and one or more coupling pins inserted into the through hole and connecting the plurality of laminated plates. The present invention can miniaturize a thickness of a substrate comparing with an existing multi-layer printed circuit board so as to miniaturize a via hole, diversify a bump size, increase insulation, dimensional stability, strength and hardness and prevent cracks caused by drilling and the like, thereby achieving excellent processability. According to the present invention, the multi-layer printed circuit board has above characteristics, so that the laminated plate does not peel or float even when the laminated plate receives high-temperature thermal shock. Moreover, a change in mechanical strength and electrical characteristics does not occur and the present invention can provide excellent image quality so as to be widely used for an internal sensor module of a dental intraoral sensor and the like.
본 발명에 따른 다층 인쇄회로기판은 하나 또는 복수의 관통홀을 가지는 다수의 적층판 및 상기 관통홀에 삽입되어 다수의 적층판을 접합하는 하나 또는 복수의 결합핀을 포함함으로써, 기존의 다층 인쇄회로기판에 비해 기판의 두께를 소형화할 수 있으며, 그에 따른 비아홀(via hole)의 소형화와 범프 사이즈의 다양화 및 절연성, 치수 안정성, 강도, 경도 향상 및 드릴 가공 등에 따른 크랙을 방지하여 우수한 가공성을 달성할 수 있다. 본 발명에 따른 다층 인쇄회로기판은 상기와 같은 특징을 가져 고온의 열충격을 받더라도 적층판이 박리 또는 들뜨는 현상이 유발되지 않으므로, 기계적 강도와 전기적 특성에 변화가 발생하지 않으며, 뛰어난 이미지 품질을 제공할 수 있어 치과용 인트라 오랄 센서의 내부 센서 모듈 등에 널리 사용될 수 있다. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR101954078BB1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR101954078BB1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR101954078BB13</originalsourceid><addsrcrecordid>eNqNyj0KAjEQQOFtLES9w4D1wgYVtXRFEexEsFxmsxMNJJmQZApv7w8ewOoV7xtXtx14DGJQF0k23MFTefAAbIATOsgUMieQ_HnxLQpom7TYAj1j-sJerBtqieDFFQsOn5Sm1cigyzT7dVLNj4fr_lRT5I5yRE2BSne-qEZtV8tmvWlbtfhPvQAxKzrI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>A manufacturing method of oral sensor using print circuit board of build-up multi layer</title><source>esp@cenet</source><creator>OH GUEN YOUNG ; HONG SAM PYO ; YANG JIN GYU</creator><creatorcontrib>OH GUEN YOUNG ; HONG SAM PYO ; YANG JIN GYU</creatorcontrib><description>According to the present invention, a multi-layer printed circuit board comprises: a plurality of laminated plates having one or more through holes; and one or more coupling pins inserted into the through hole and connecting the plurality of laminated plates. The present invention can miniaturize a thickness of a substrate comparing with an existing multi-layer printed circuit board so as to miniaturize a via hole, diversify a bump size, increase insulation, dimensional stability, strength and hardness and prevent cracks caused by drilling and the like, thereby achieving excellent processability. According to the present invention, the multi-layer printed circuit board has above characteristics, so that the laminated plate does not peel or float even when the laminated plate receives high-temperature thermal shock. Moreover, a change in mechanical strength and electrical characteristics does not occur and the present invention can provide excellent image quality so as to be widely used for an internal sensor module of a dental intraoral sensor and the like.
본 발명에 따른 다층 인쇄회로기판은 하나 또는 복수의 관통홀을 가지는 다수의 적층판 및 상기 관통홀에 삽입되어 다수의 적층판을 접합하는 하나 또는 복수의 결합핀을 포함함으로써, 기존의 다층 인쇄회로기판에 비해 기판의 두께를 소형화할 수 있으며, 그에 따른 비아홀(via hole)의 소형화와 범프 사이즈의 다양화 및 절연성, 치수 안정성, 강도, 경도 향상 및 드릴 가공 등에 따른 크랙을 방지하여 우수한 가공성을 달성할 수 있다. 본 발명에 따른 다층 인쇄회로기판은 상기와 같은 특징을 가져 고온의 열충격을 받더라도 적층판이 박리 또는 들뜨는 현상이 유발되지 않으므로, 기계적 강도와 전기적 특성에 변화가 발생하지 않으며, 뛰어난 이미지 품질을 제공할 수 있어 치과용 인트라 오랄 센서의 내부 센서 모듈 등에 널리 사용될 수 있다.</description><language>eng ; kor</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; DIAGNOSIS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HUMAN NECESSITIES ; HYGIENE ; IDENTIFICATION ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MEDICAL OR VETERINARY SCIENCE ; PRINTED CIRCUITS ; SURGERY</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190306&DB=EPODOC&CC=KR&NR=101954078B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190306&DB=EPODOC&CC=KR&NR=101954078B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OH GUEN YOUNG</creatorcontrib><creatorcontrib>HONG SAM PYO</creatorcontrib><creatorcontrib>YANG JIN GYU</creatorcontrib><title>A manufacturing method of oral sensor using print circuit board of build-up multi layer</title><description>According to the present invention, a multi-layer printed circuit board comprises: a plurality of laminated plates having one or more through holes; and one or more coupling pins inserted into the through hole and connecting the plurality of laminated plates. The present invention can miniaturize a thickness of a substrate comparing with an existing multi-layer printed circuit board so as to miniaturize a via hole, diversify a bump size, increase insulation, dimensional stability, strength and hardness and prevent cracks caused by drilling and the like, thereby achieving excellent processability. According to the present invention, the multi-layer printed circuit board has above characteristics, so that the laminated plate does not peel or float even when the laminated plate receives high-temperature thermal shock. Moreover, a change in mechanical strength and electrical characteristics does not occur and the present invention can provide excellent image quality so as to be widely used for an internal sensor module of a dental intraoral sensor and the like.
본 발명에 따른 다층 인쇄회로기판은 하나 또는 복수의 관통홀을 가지는 다수의 적층판 및 상기 관통홀에 삽입되어 다수의 적층판을 접합하는 하나 또는 복수의 결합핀을 포함함으로써, 기존의 다층 인쇄회로기판에 비해 기판의 두께를 소형화할 수 있으며, 그에 따른 비아홀(via hole)의 소형화와 범프 사이즈의 다양화 및 절연성, 치수 안정성, 강도, 경도 향상 및 드릴 가공 등에 따른 크랙을 방지하여 우수한 가공성을 달성할 수 있다. 본 발명에 따른 다층 인쇄회로기판은 상기와 같은 특징을 가져 고온의 열충격을 받더라도 적층판이 박리 또는 들뜨는 현상이 유발되지 않으므로, 기계적 강도와 전기적 특성에 변화가 발생하지 않으며, 뛰어난 이미지 품질을 제공할 수 있어 치과용 인트라 오랄 센서의 내부 센서 모듈 등에 널리 사용될 수 있다.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>DIAGNOSIS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HUMAN NECESSITIES</subject><subject>HYGIENE</subject><subject>IDENTIFICATION</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MEDICAL OR VETERINARY SCIENCE</subject><subject>PRINTED CIRCUITS</subject><subject>SURGERY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyj0KAjEQQOFtLES9w4D1wgYVtXRFEexEsFxmsxMNJJmQZApv7w8ewOoV7xtXtx14DGJQF0k23MFTefAAbIATOsgUMieQ_HnxLQpom7TYAj1j-sJerBtqieDFFQsOn5Sm1cigyzT7dVLNj4fr_lRT5I5yRE2BSne-qEZtV8tmvWlbtfhPvQAxKzrI</recordid><startdate>20190306</startdate><enddate>20190306</enddate><creator>OH GUEN YOUNG</creator><creator>HONG SAM PYO</creator><creator>YANG JIN GYU</creator><scope>EVB</scope></search><sort><creationdate>20190306</creationdate><title>A manufacturing method of oral sensor using print circuit board of build-up multi layer</title><author>OH GUEN YOUNG ; HONG SAM PYO ; YANG JIN GYU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR101954078BB13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2019</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>DIAGNOSIS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HUMAN NECESSITIES</topic><topic>HYGIENE</topic><topic>IDENTIFICATION</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MEDICAL OR VETERINARY SCIENCE</topic><topic>PRINTED CIRCUITS</topic><topic>SURGERY</topic><toplevel>online_resources</toplevel><creatorcontrib>OH GUEN YOUNG</creatorcontrib><creatorcontrib>HONG SAM PYO</creatorcontrib><creatorcontrib>YANG JIN GYU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OH GUEN YOUNG</au><au>HONG SAM PYO</au><au>YANG JIN GYU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>A manufacturing method of oral sensor using print circuit board of build-up multi layer</title><date>2019-03-06</date><risdate>2019</risdate><abstract>According to the present invention, a multi-layer printed circuit board comprises: a plurality of laminated plates having one or more through holes; and one or more coupling pins inserted into the through hole and connecting the plurality of laminated plates. The present invention can miniaturize a thickness of a substrate comparing with an existing multi-layer printed circuit board so as to miniaturize a via hole, diversify a bump size, increase insulation, dimensional stability, strength and hardness and prevent cracks caused by drilling and the like, thereby achieving excellent processability. According to the present invention, the multi-layer printed circuit board has above characteristics, so that the laminated plate does not peel or float even when the laminated plate receives high-temperature thermal shock. Moreover, a change in mechanical strength and electrical characteristics does not occur and the present invention can provide excellent image quality so as to be widely used for an internal sensor module of a dental intraoral sensor and the like.
본 발명에 따른 다층 인쇄회로기판은 하나 또는 복수의 관통홀을 가지는 다수의 적층판 및 상기 관통홀에 삽입되어 다수의 적층판을 접합하는 하나 또는 복수의 결합핀을 포함함으로써, 기존의 다층 인쇄회로기판에 비해 기판의 두께를 소형화할 수 있으며, 그에 따른 비아홀(via hole)의 소형화와 범프 사이즈의 다양화 및 절연성, 치수 안정성, 강도, 경도 향상 및 드릴 가공 등에 따른 크랙을 방지하여 우수한 가공성을 달성할 수 있다. 본 발명에 따른 다층 인쇄회로기판은 상기와 같은 특징을 가져 고온의 열충격을 받더라도 적층판이 박리 또는 들뜨는 현상이 유발되지 않으므로, 기계적 강도와 전기적 특성에 변화가 발생하지 않으며, 뛰어난 이미지 품질을 제공할 수 있어 치과용 인트라 오랄 센서의 내부 센서 모듈 등에 널리 사용될 수 있다.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; kor |
| recordid | cdi_epo_espacenet_KR101954078BB1 |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DIAGNOSIS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HUMAN NECESSITIES HYGIENE IDENTIFICATION MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEDICAL OR VETERINARY SCIENCE PRINTED CIRCUITS SURGERY |
| title | A manufacturing method of oral sensor using print circuit board of build-up multi layer |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-18T08%3A25%3A23IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=OH%20GUEN%20YOUNG&rft.date=2019-03-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR101954078BB1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |