TIN ELECTROPLATING SOLUTION AND PLATING METHOD USING THE SAME
Disclosed are a tin electroplating solution which can reduce an illuminance value of a plating film when plating an electronic component, and an electroplating method using the same. According to an embodiment of the present invention, the tin electroplating solution comprises: a tin salt providing...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | Disclosed are a tin electroplating solution which can reduce an illuminance value of a plating film when plating an electronic component, and an electroplating method using the same. According to an embodiment of the present invention, the tin electroplating solution comprises: a tin salt providing a divalent tin ion; an electrolyte; a pH adjusting agent; a surfactant; a complexing agent; and an auxiliary complexing agent. As the complexing agent uses two or more compounds by including tartaric acid, the tartaric acid is included as much as the amount of 100-200 g per 1 L of the tin electroplating solution. In addition, the auxiliary complexing agent uses an ethoxylate system, and is included as much as the amount of 5-15g per 1 L of the tin electroplating solution.
주석 전기 도금액 및 이를 이용한 전기 도금 방법이 개시된다. 일 실시예에 따른 주석 전기 도금액은 2가 주석 이온을 제공하는 주석염, 전해질, 피에이치(pH) 조정제, 계면 활성제, 착화제 및 보조 착화제를 포함한다. 그리고 착화제로는 타르타르산이 포함되어 2종 이상의 화합물이 사용되되, 타르타르산은 상기 주석 전기 도금액 1L에 대하여 100g 내지 200g이 포함된다. 또한, 보조 착화제는 에톡실레이트(Ethoxylate)계가 사용되되, 주석 전기 도금액 1L에 대하여 5g 내지 15g이 포함된다. |
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