Nano-Metal Colloidal Catalyst Composition For Electroless Cupper Plating making method therefor and Electroless Cuppoer Plating Method Using The Same
The present invention relates to a catalyst composition of electroless copper plating, a preparation method thereof, and an electroless copper plating method using the same and, more specifically, to a method for preparing an Ag catalyst instead of a Pd catalyst, a catalyst composition of electroles...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; kor |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | LEE, TAE HO HAN, DEOK GON KWON, HYUK SUK |
| description | The present invention relates to a catalyst composition of electroless copper plating, a preparation method thereof, and an electroless copper plating method using the same and, more specifically, to a method for preparing an Ag catalyst instead of a Pd catalyst, a catalyst composition of electroless copper plating with Ag and other metals together, a method for preparing the same, and an electroless copper plating method using the same.
본 발명은 무전해 동도금의 촉매 조성물, 이를 제조하는 방법 및 이를 이용한 무전해 동도금 방법에 관한 것이다. 보다 상세하게는, 본원발명은 Pd 촉매를 대체할 수 있는 Ag 촉매를 제조하는 방법이며, Ag와 타 금속을 함께 사용하는 무전해 동도금의 촉매 조성물, 이를 제조하는 방법 및 이를 이용한 무전해 동도금 방법에 관한 것이다. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR101692287BB1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR101692287BB1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR101692287BB13</originalsourceid><addsrcrecordid>eNqNi70KwkAQhNNYiPoOC9YBE8GfNiFBkIhorGVJNiZ4uT3u1sIH8X1N1EKwsfpmhvmG3mOHmv2MBBXErBQ3ZZ-w63cn3dQado00rCFlC4miQiwrcg7imzFkYa9QGn2BFq8vkNRcgtRkqeoM1OWPxV9a9v6fXF_ymuCILY29QYXK0eTDkTdNkzze-GT4TM5gQZrkvD0Es2CxDsPVMoqC-X-vJz19UZQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Nano-Metal Colloidal Catalyst Composition For Electroless Cupper Plating making method therefor and Electroless Cuppoer Plating Method Using The Same</title><source>esp@cenet</source><creator>LEE, TAE HO ; HAN, DEOK GON ; KWON, HYUK SUK</creator><creatorcontrib>LEE, TAE HO ; HAN, DEOK GON ; KWON, HYUK SUK</creatorcontrib><description>The present invention relates to a catalyst composition of electroless copper plating, a preparation method thereof, and an electroless copper plating method using the same and, more specifically, to a method for preparing an Ag catalyst instead of a Pd catalyst, a catalyst composition of electroless copper plating with Ag and other metals together, a method for preparing the same, and an electroless copper plating method using the same.
본 발명은 무전해 동도금의 촉매 조성물, 이를 제조하는 방법 및 이를 이용한 무전해 동도금 방법에 관한 것이다. 보다 상세하게는, 본원발명은 Pd 촉매를 대체할 수 있는 Ag 촉매를 제조하는 방법이며, Ag와 타 금속을 함께 사용하는 무전해 동도금의 촉매 조성물, 이를 제조하는 방법 및 이를 이용한 무전해 동도금 방법에 관한 것이다.</description><language>eng ; kor</language><subject>CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; PERFORMING OPERATIONS ; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; THEIR RELEVANT APPARATUS ; TRANSPORTING</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170117&DB=EPODOC&CC=KR&NR=101692287B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170117&DB=EPODOC&CC=KR&NR=101692287B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE, TAE HO</creatorcontrib><creatorcontrib>HAN, DEOK GON</creatorcontrib><creatorcontrib>KWON, HYUK SUK</creatorcontrib><title>Nano-Metal Colloidal Catalyst Composition For Electroless Cupper Plating making method therefor and Electroless Cuppoer Plating Method Using The Same</title><description>The present invention relates to a catalyst composition of electroless copper plating, a preparation method thereof, and an electroless copper plating method using the same and, more specifically, to a method for preparing an Ag catalyst instead of a Pd catalyst, a catalyst composition of electroless copper plating with Ag and other metals together, a method for preparing the same, and an electroless copper plating method using the same.
본 발명은 무전해 동도금의 촉매 조성물, 이를 제조하는 방법 및 이를 이용한 무전해 동도금 방법에 관한 것이다. 보다 상세하게는, 본원발명은 Pd 촉매를 대체할 수 있는 Ag 촉매를 제조하는 방법이며, Ag와 타 금속을 함께 사용하는 무전해 동도금의 촉매 조성물, 이를 제조하는 방법 및 이를 이용한 무전해 동도금 방법에 관한 것이다.</description><subject>CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>THEIR RELEVANT APPARATUS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi70KwkAQhNNYiPoOC9YBE8GfNiFBkIhorGVJNiZ4uT3u1sIH8X1N1EKwsfpmhvmG3mOHmv2MBBXErBQ3ZZ-w63cn3dQado00rCFlC4miQiwrcg7imzFkYa9QGn2BFq8vkNRcgtRkqeoM1OWPxV9a9v6fXF_ymuCILY29QYXK0eTDkTdNkzze-GT4TM5gQZrkvD0Es2CxDsPVMoqC-X-vJz19UZQ</recordid><startdate>20170117</startdate><enddate>20170117</enddate><creator>LEE, TAE HO</creator><creator>HAN, DEOK GON</creator><creator>KWON, HYUK SUK</creator><scope>EVB</scope></search><sort><creationdate>20170117</creationdate><title>Nano-Metal Colloidal Catalyst Composition For Electroless Cupper Plating making method therefor and Electroless Cuppoer Plating Method Using The Same</title><author>LEE, TAE HO ; HAN, DEOK GON ; KWON, HYUK SUK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR101692287BB13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2017</creationdate><topic>CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>THEIR RELEVANT APPARATUS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE, TAE HO</creatorcontrib><creatorcontrib>HAN, DEOK GON</creatorcontrib><creatorcontrib>KWON, HYUK SUK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE, TAE HO</au><au>HAN, DEOK GON</au><au>KWON, HYUK SUK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Nano-Metal Colloidal Catalyst Composition For Electroless Cupper Plating making method therefor and Electroless Cuppoer Plating Method Using The Same</title><date>2017-01-17</date><risdate>2017</risdate><abstract>The present invention relates to a catalyst composition of electroless copper plating, a preparation method thereof, and an electroless copper plating method using the same and, more specifically, to a method for preparing an Ag catalyst instead of a Pd catalyst, a catalyst composition of electroless copper plating with Ag and other metals together, a method for preparing the same, and an electroless copper plating method using the same.
본 발명은 무전해 동도금의 촉매 조성물, 이를 제조하는 방법 및 이를 이용한 무전해 동도금 방법에 관한 것이다. 보다 상세하게는, 본원발명은 Pd 촉매를 대체할 수 있는 Ag 촉매를 제조하는 방법이며, Ag와 타 금속을 함께 사용하는 무전해 동도금의 촉매 조성물, 이를 제조하는 방법 및 이를 이용한 무전해 동도금 방법에 관한 것이다.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; kor |
| recordid | cdi_epo_espacenet_KR101692287BB1 |
| source | esp@cenet |
| subjects | CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION THEIR RELEVANT APPARATUS TRANSPORTING |
| title | Nano-Metal Colloidal Catalyst Composition For Electroless Cupper Plating making method therefor and Electroless Cuppoer Plating Method Using The Same |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-14T15%3A36%3A34IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LEE,%20TAE%20HO&rft.date=2017-01-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR101692287BB1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |