Apparatus for supplying slurry of wafer polishing apparatus

The present invention relates to a slurry supplying apparatus for a wafer polishing apparatus comprising: a fixed block fixed and installed in the wafer polishing apparatus; a cleaning water supply pipe arranged in parallel with the fixed block in an upper part of the fixed block; a cleaning water s...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	LEE, GYE JIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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