COMBINED ELECTRO STATIC CHUCK AND HEATER

The present invention relates to a heater-cum-electrostatic chuck including a metallic base material; a dielectric layer that is formed on the metallic base material; and an electrode layer that is provided in the dielectric layer and is capable of performing electrostatic force generation and heat generation at the same time and, more particularly, to a heater-cum-electrostatic chuck in which a high-pressure power supply for electrostatic force generation and a low-pressure power supply for electrode heating are connected at the same time to the electrode layer positioned in the dielectric layer so that a silicon wafer is fixed during a plasma process by the single electrode layer and the wafer heating function can be provided. The heater-cum-electrostatic chuck according to the present invention is capable of temperature adjustment even without an additionally mounted heater and generates the electrostatic force so that the silicon wafer can be fixed. Accordingly, the heater-cum-electrostatic chuck according to the present invention can be used effectively in processes such as high-density and high-temperature dry etching following a decrease in line width. In particular, the present invention can be applied so that both a chuck function and a heater function can be realized at the same time even without having to significantly modifying an electrostatic chuck system of the related art with no temperature control function. Accordingly, the existing manufacturing processes and devices can be used as they are and economic feasibility can be very high, which results in the immediate use in industrial sites.