DUAL MESH TYPE ELECTRO-CHEMICAL PLATING APPARATUS AND ELECTRO-CHEMICAL PLATING METHOD OF PRINTED CIRCUIT BOARD USING THE SAME

Disclosed are a dual mesh type electro-chemical plating apparatus which is capable of reducing consumption of a plating liquid and controlling a product quality by improving a plating variation by supplementing a plating weak part, and an electro-chemical plating method of a printed circuit board us...

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Bibliographische Detailangaben

Hauptverfasser:	PARK, JUNG KUN, HWANG, TAE WON, NAM, DO HYEON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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