DUAL MESH TYPE ELECTRO-CHEMICAL PLATING APPARATUS AND ELECTRO-CHEMICAL PLATING METHOD OF PRINTED CIRCUIT BOARD USING THE SAME

Disclosed are a dual mesh type electro-chemical plating apparatus which is capable of reducing consumption of a plating liquid and controlling a product quality by improving a plating variation by supplementing a plating weak part, and an electro-chemical plating method of a printed circuit board using the same. According to the present invention, a dual mesh type electro-chemical plating apparatus comprises: a plating bath for accommodating a plating solution; a positive pole rod mounted on both edges of the plating bath; a negative rod mounted on the center of the plating bath and connected to a printed circuit board; a metal mesh mounted to be fixated to an end of the negative rod; a supplementary negative rod which is mounted on the center of the plating bath, and which is arranged in a position corresponding to the center of the printed circuit board; and a supplementary metal mesh mounted on an end of the supplementary negative rod.