METHOD FOR SEALING FRIT USING LASER
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| creator | HWANG, NAM GU NOH, SHIN YEON JEON, KWANG JIN CHOI, EI HO SONG, JOO JONG PARK, HONG JIN HAN, JAE BONG |
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CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111010&DB=EPODOC&CC=KR&NR=101071166B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111010&DB=EPODOC&CC=KR&NR=101071166B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HWANG, NAM GU</creatorcontrib><creatorcontrib>NOH, SHIN YEON</creatorcontrib><creatorcontrib>JEON, KWANG JIN</creatorcontrib><creatorcontrib>CHOI, EI HO</creatorcontrib><creatorcontrib>SONG, JOO JONG</creatorcontrib><creatorcontrib>PARK, HONG JIN</creatorcontrib><creatorcontrib>HAN, JAE BONG</creatorcontrib><title>METHOD FOR SEALING FRIT USING LASER</title><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC HEATING</subject><subject>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD2dQ3x8HdRcPMPUgh2dfTx9HNXcAvyDFEIDQYxfRyDXYN4GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakm8d5ChgaGBuaGhmZmTk6ExcaoA0KQjeQ</recordid><startdate>20111010</startdate><enddate>20111010</enddate><creator>HWANG, NAM GU</creator><creator>NOH, SHIN YEON</creator><creator>JEON, KWANG JIN</creator><creator>CHOI, EI HO</creator><creator>SONG, JOO JONG</creator><creator>PARK, HONG JIN</creator><creator>HAN, JAE BONG</creator><scope>EVB</scope></search><sort><creationdate>20111010</creationdate><title>METHOD FOR SEALING FRIT USING LASER</title><author>HWANG, NAM GU ; 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| language | eng ; kor |
| recordid | cdi_epo_espacenet_KR101071166BB1 |
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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | METHOD FOR SEALING FRIT USING LASER |
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