COATING METHOD FOR LIGHT EMITTING DIODE
PURPOSE: A method for coating a light emitting diode is provided to reduce the loss due to coating errors by fixing a light emitting diode on a mount or performing a coating process before a wire bonding process. CONSTITUTION: A coating material is provided on a light emitting diode. The light which...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng ; kor |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | BANG, DONG SOO |
description | PURPOSE: A method for coating a light emitting diode is provided to reduce the loss due to coating errors by fixing a light emitting diode on a mount or performing a coating process before a wire bonding process. CONSTITUTION: A coating material is provided on a light emitting diode. The light which does not penetrate a bonding pad is selectively irradiated on a coating material from a multilayer semiconductor layer a bonding pad so as to form a hardened coating layer on the light emitting diode. The coating material which is not hardened is removed therefrom. The coating material formed on the bonding pad is not hardened. The light is irradiated in the vertical direction from the lower part of the multiplayer semiconductor layer to the bonding pad. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR101051328BB1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR101051328BB1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR101051328BB13</originalsourceid><addsrcrecordid>eNrjZFB39ncM8fRzV_B1DfHwd1Fw8w9S8PF09whRcPX1DAHLuHj6u7jyMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JJ47yBDA0MDU0NjIwsnJ0Nj4lQBAFzwJIc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>COATING METHOD FOR LIGHT EMITTING DIODE</title><source>esp@cenet</source><creator>BANG, DONG SOO</creator><creatorcontrib>BANG, DONG SOO</creatorcontrib><description>PURPOSE: A method for coating a light emitting diode is provided to reduce the loss due to coating errors by fixing a light emitting diode on a mount or performing a coating process before a wire bonding process. CONSTITUTION: A coating material is provided on a light emitting diode. The light which does not penetrate a bonding pad is selectively irradiated on a coating material from a multilayer semiconductor layer a bonding pad so as to form a hardened coating layer on the light emitting diode. The coating material which is not hardened is removed therefrom. The coating material formed on the bonding pad is not hardened. The light is irradiated in the vertical direction from the lower part of the multiplayer semiconductor layer to the bonding pad.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110722&DB=EPODOC&CC=KR&NR=101051328B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110722&DB=EPODOC&CC=KR&NR=101051328B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BANG, DONG SOO</creatorcontrib><title>COATING METHOD FOR LIGHT EMITTING DIODE</title><description>PURPOSE: A method for coating a light emitting diode is provided to reduce the loss due to coating errors by fixing a light emitting diode on a mount or performing a coating process before a wire bonding process. CONSTITUTION: A coating material is provided on a light emitting diode. The light which does not penetrate a bonding pad is selectively irradiated on a coating material from a multilayer semiconductor layer a bonding pad so as to form a hardened coating layer on the light emitting diode. The coating material which is not hardened is removed therefrom. The coating material formed on the bonding pad is not hardened. The light is irradiated in the vertical direction from the lower part of the multiplayer semiconductor layer to the bonding pad.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB39ncM8fRzV_B1DfHwd1Fw8w9S8PF09whRcPX1DAHLuHj6u7jyMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JJ47yBDA0MDU0NjIwsnJ0Nj4lQBAFzwJIc</recordid><startdate>20110722</startdate><enddate>20110722</enddate><creator>BANG, DONG SOO</creator><scope>EVB</scope></search><sort><creationdate>20110722</creationdate><title>COATING METHOD FOR LIGHT EMITTING DIODE</title><author>BANG, DONG SOO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR101051328BB13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>BANG, DONG SOO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BANG, DONG SOO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COATING METHOD FOR LIGHT EMITTING DIODE</title><date>2011-07-22</date><risdate>2011</risdate><abstract>PURPOSE: A method for coating a light emitting diode is provided to reduce the loss due to coating errors by fixing a light emitting diode on a mount or performing a coating process before a wire bonding process. CONSTITUTION: A coating material is provided on a light emitting diode. The light which does not penetrate a bonding pad is selectively irradiated on a coating material from a multilayer semiconductor layer a bonding pad so as to form a hardened coating layer on the light emitting diode. The coating material which is not hardened is removed therefrom. The coating material formed on the bonding pad is not hardened. The light is irradiated in the vertical direction from the lower part of the multiplayer semiconductor layer to the bonding pad.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng ; kor |
recordid | cdi_epo_espacenet_KR101051328BB1 |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | COATING METHOD FOR LIGHT EMITTING DIODE |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-18T13%3A59%3A35IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=BANG,%20DONG%20SOO&rft.date=2011-07-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR101051328BB1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |