METHOD OF LOADING AND UNLOADING MODULE IC IN THE TEST PART OF MODULE IC HANDLER AND DEVICE THEREOF

METHOD OF LOADING AND UNLOADING MODULE IC IN THE TEST PART OF MODULE IC HANDLER AND DEVICE THEREOF

An apparatus and method for loading/unloading module IC in a test unit of a module IC handler are provided to remarkably reduce the time required for loading and unloading of the module IC by using a gripper unit having a loading gripper and an unloading gripper. A pair of ball screws(52) are instal...

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Hauptverfasser: LEE, KI HYUN, JUNG, BYUNG IL, LEE, WAN KU, CHOI, WON HO, SONG, GI YOUNG, KIM, WON
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LEE, KI HYUN
JUNG, BYUNG IL
LEE, WAN KU
CHOI, WON HO
SONG, GI YOUNG
KIM, WON
description An apparatus and method for loading/unloading module IC in a test unit of a module IC handler are provided to remarkably reduce the time required for loading and unloading of the module IC by using a gripper unit having a loading gripper and an unloading gripper. A pair of ball screws(52) are installed on brackets(51) positioned on both inner sides of a lifting member(42), and have reverse thread portions(52a) at both sides thereof. A gripper unit(53) having two grippers(54) are screwed with the thread portion of each ball screw to insert or retract a module IC into or from a socket. The gripper unit includes four sliders(56) engaged with the ball screw, coupling members(57) each fixed to the sliders, a pair of loading grippers(54) and an unloading gripper installed on the coupling members, and a pusher fixed to the unloading gripper.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title METHOD OF LOADING AND UNLOADING MODULE IC IN THE TEST PART OF MODULE IC HANDLER AND DEVICE THEREOF
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