METHOD FOR FORMING SEPARATIVE REGION OF LDMOS TRANSISTOR
PURPOSE: A method for forming a separative region of an LDMOS(Lateral Double diffused MOS) transistor is provided to improve reliability and productivity by simplifying a fabricating process of an isolation region. CONSTITUTION: A p-type epitaxial layer(23) is formed on an upper portion of an insula...
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creator | LEE, IK HUI LEE, CHANG JAE |
description | PURPOSE: A method for forming a separative region of an LDMOS(Lateral Double diffused MOS) transistor is provided to improve reliability and productivity by simplifying a fabricating process of an isolation region. CONSTITUTION: A p-type epitaxial layer(23) is formed on an upper portion of an insulating oxide layer(22) of a semiconductor substrate(21). A high voltage transistor region is defined by forming a p-type well(24) and an n-type drift(25) on an upper portion of the p-type epitaxial layer(23). A trench structure is formed on an edge of high voltage transistor region. An oxide layer(26) is grown on a wall side of the trench structure. An oxide layer(27) and a polysilicon(28) are deposited on an upper portion of the semiconductor substrate(21). An oxide layer(29) is deposited on a surface of the whole structure. A photo-resist is coated thereon. The photo-resist is formed partially on the oxide layer(29) by performing an exposure process and a development process. The remaining oxide layer(29) is etched by performing a wet etch process. |
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CONSTITUTION: A p-type epitaxial layer(23) is formed on an upper portion of an insulating oxide layer(22) of a semiconductor substrate(21). A high voltage transistor region is defined by forming a p-type well(24) and an n-type drift(25) on an upper portion of the p-type epitaxial layer(23). A trench structure is formed on an edge of high voltage transistor region. An oxide layer(26) is grown on a wall side of the trench structure. An oxide layer(27) and a polysilicon(28) are deposited on an upper portion of the semiconductor substrate(21). An oxide layer(29) is deposited on a surface of the whole structure. A photo-resist is coated thereon. The photo-resist is formed partially on the oxide layer(29) by performing an exposure process and a development process. 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CONSTITUTION: A p-type epitaxial layer(23) is formed on an upper portion of an insulating oxide layer(22) of a semiconductor substrate(21). A high voltage transistor region is defined by forming a p-type well(24) and an n-type drift(25) on an upper portion of the p-type epitaxial layer(23). A trench structure is formed on an edge of high voltage transistor region. An oxide layer(26) is grown on a wall side of the trench structure. An oxide layer(27) and a polysilicon(28) are deposited on an upper portion of the semiconductor substrate(21). An oxide layer(29) is deposited on a surface of the whole structure. A photo-resist is coated thereon. The photo-resist is formed partially on the oxide layer(29) by performing an exposure process and a development process. 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CONSTITUTION: A p-type epitaxial layer(23) is formed on an upper portion of an insulating oxide layer(22) of a semiconductor substrate(21). A high voltage transistor region is defined by forming a p-type well(24) and an n-type drift(25) on an upper portion of the p-type epitaxial layer(23). A trench structure is formed on an edge of high voltage transistor region. An oxide layer(26) is grown on a wall side of the trench structure. An oxide layer(27) and a polysilicon(28) are deposited on an upper portion of the semiconductor substrate(21). An oxide layer(29) is deposited on a surface of the whole structure. A photo-resist is coated thereon. The photo-resist is formed partially on the oxide layer(29) by performing an exposure process and a development process. The remaining oxide layer(29) is etched by performing a wet etch process.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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title | METHOD FOR FORMING SEPARATIVE REGION OF LDMOS TRANSISTOR |
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