HOT PRESS

PROBLEM TO BE SOLVED: To provide a hot press reducing the in-plane irregularity of the heating and pressing to a base plate to be bonded to enhance the thickness accuracy of the base plate and capable of producing the base plate to be bonded with good workability. SOLUTION: One sides of two frames h...

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Hauptverfasser:	HISATOMI, KENJI, MIYASHITA, AKEMI, FUKUDA, MITSUO, FUJII, MUTSUMASA
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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creator	HISATOMI, KENJI MIYASHITA, AKEMI FUKUDA, MITSUO FUJII, MUTSUMASA
description	PROBLEM TO BE SOLVED: To provide a hot press reducing the in-plane irregularity of the heating and pressing to a base plate to be bonded to enhance the thickness accuracy of the base plate and capable of producing the base plate to be bonded with good workability. SOLUTION: One sides of two frames having membrane sheets 21, 26 respectively bonded thereto are mutually fixed in a freely openable and closable manner by a hinge 20 and a clamp mechanism 18 and an opening and closing protruding part are provided to one sides on the side opposite to the hinge attaching position of the frames to constitute a hermetically sealed member S and the operation mechanisms 6b, 5b of the clamp mechanism 18 and the opening and closing protruding part are provided to the upper part in a tank 2 and a heating medium vapor generation part 9 is provided to the lower part in the tank 2. The hermetically closed member is raised and lowered by the lift mechanism 4 provided to the tank 2 and the hermetically sealed member S in which a base plate 24 to be bonded is inserted is clamped, released, opened and closed in the upper part of the tank by an operation mechanism and heated in the lower part of the tank by the vapor of a heating medium 8 in the pressed state by the operation of a vacuum exhaust device 40.
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The hermetically closed member is raised and lowered by the lift mechanism 4 provided to the tank 2 and the hermetically sealed member S in which a base plate 24 to be bonded is inserted is clamped, released, opened and closed in the upper part of the tank by an operation mechanism and heated in the lower part of the tank by the vapor of a heating medium 8 in the pressed state by the operation of a vacuum exhaust device 40.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
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subjects	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
title	HOT PRESS
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