SEMICONDUCTOR DEVICE

PURPOSE:To make it possible to maintain high reliability without decreasing adhesion between an element and a lead frame at a high temperature in a high humidity atmosphere, by bonding a semiconductor element to the taps of the lead frame through silicone rubber. CONSTITUTION:Silicone prepolymer is...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YOKOYAMA TAKASHI, OGATA MASAJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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