DIELECTRIC SUBSTRATE
PURPOSE:To enhance bonding strength between a dielectric base material and an aluminum sheet by a method wherein a face facing at least the dielectric base material out of surfaces of the aluminum sheet is Alumite-treated. CONSTITUTION:Two dielectric base materials composed of a glass cloth 1 and cr...
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| creator | MOTOGAMI MITSURU SHIBAGAKI KAZUYOSHI |
| description | PURPOSE:To enhance bonding strength between a dielectric base material and an aluminum sheet by a method wherein a face facing at least the dielectric base material out of surfaces of the aluminum sheet is Alumite-treated. CONSTITUTION:Two dielectric base materials composed of a glass cloth 1 and cross-linked polyethylene layers 2 which have been impregnated into the cloth 1 and cover its surfaces are piled up; copper foil 4 and an aluminum sheet 5 are bonded to both faces of these piled-up base materials via cross-linked UHPE layers 3. An Alumite-treated layer 6 installed on the surface facing the dielectric base material at the aluminum sheet 5 and a cross-linked polyethylene sheet 7 used to reinforce a bonding force between the dielectric base materials are formed. The Alumite-treated layer 6 is used to enhance bonding strength between the aluminum sheet 5 and the dielectric base material, and its thickness is preferably less than 10mum. |
| format | Patent |
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CONSTITUTION:Two dielectric base materials composed of a glass cloth 1 and cross-linked polyethylene layers 2 which have been impregnated into the cloth 1 and cover its surfaces are piled up; copper foil 4 and an aluminum sheet 5 are bonded to both faces of these piled-up base materials via cross-linked UHPE layers 3. An Alumite-treated layer 6 installed on the surface facing the dielectric base material at the aluminum sheet 5 and a cross-linked polyethylene sheet 7 used to reinforce a bonding force between the dielectric base materials are formed. 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CONSTITUTION:Two dielectric base materials composed of a glass cloth 1 and cross-linked polyethylene layers 2 which have been impregnated into the cloth 1 and cover its surfaces are piled up; copper foil 4 and an aluminum sheet 5 are bonded to both faces of these piled-up base materials via cross-linked UHPE layers 3. An Alumite-treated layer 6 installed on the surface facing the dielectric base material at the aluminum sheet 5 and a cross-linked polyethylene sheet 7 used to reinforce a bonding force between the dielectric base materials are formed. The Alumite-treated layer 6 is used to enhance bonding strength between the aluminum sheet 5 and the dielectric base material, and its thickness is preferably less than 10mum.</description><subject>ANTENNAS, i.e. RADIO AERIALS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1989</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBx8XT1cXUOCfJ0VggOdQoOCXIMceVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfFeAcFmJhYm5hbGjsZEKAEAUrMetg</recordid><startdate>19890330</startdate><enddate>19890330</enddate><creator>MOTOGAMI MITSURU</creator><creator>SHIBAGAKI KAZUYOSHI</creator><scope>EVB</scope></search><sort><creationdate>19890330</creationdate><title>DIELECTRIC SUBSTRATE</title><author>MOTOGAMI MITSURU ; SHIBAGAKI KAZUYOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS6484783A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1989</creationdate><topic>ANTENNAS, i.e. RADIO AERIALS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MOTOGAMI MITSURU</creatorcontrib><creatorcontrib>SHIBAGAKI KAZUYOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MOTOGAMI MITSURU</au><au>SHIBAGAKI KAZUYOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DIELECTRIC SUBSTRATE</title><date>1989-03-30</date><risdate>1989</risdate><abstract>PURPOSE:To enhance bonding strength between a dielectric base material and an aluminum sheet by a method wherein a face facing at least the dielectric base material out of surfaces of the aluminum sheet is Alumite-treated. CONSTITUTION:Two dielectric base materials composed of a glass cloth 1 and cross-linked polyethylene layers 2 which have been impregnated into the cloth 1 and cover its surfaces are piled up; copper foil 4 and an aluminum sheet 5 are bonded to both faces of these piled-up base materials via cross-linked UHPE layers 3. An Alumite-treated layer 6 installed on the surface facing the dielectric base material at the aluminum sheet 5 and a cross-linked polyethylene sheet 7 used to reinforce a bonding force between the dielectric base materials are formed. The Alumite-treated layer 6 is used to enhance bonding strength between the aluminum sheet 5 and the dielectric base material, and its thickness is preferably less than 10mum.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | DIELECTRIC SUBSTRATE |
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