POLISHING DEVICE FOR PRINTING CIRCUIT BOARD

POLISHING DEVICE FOR PRINTING CIRCUIT BOARD

PURPOSE:To improve the mirror surface flatness of a printing circuit board after a polishing process by applying a ring shape to a polishing pad in such a way that the printing circuit board when positioned at the innermost and outermost sides with the rotation of a rotary holder does not come in co...

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Hauptverfasser: MAZAKI TAKASHI, ENOKIDA KENJI
Format: Patent
Sprache:eng
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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creator MAZAKI TAKASHI
ENOKIDA KENJI
description PURPOSE:To improve the mirror surface flatness of a printing circuit board after a polishing process by applying a ring shape to a polishing pad in such a way that the printing circuit board when positioned at the innermost and outermost sides with the rotation of a rotary holder does not come in contact with the internal and external surfaces of the pad. CONSTITUTION:A printing circuit board 6 such as a silicon wafer is mounted to the/PCB mounting plate 5 of a rotary holder 3 and the board 6 is processed to a mirror surface with the polishing pad 10 of a rotary disc. In this case, when the rotary holder 3 rotates and the board 6 is positioned at the outermost side 6a and innermost side 6b, the board 6 does not contact the internal and external surfaces of the circular polishing pad 10. As a result, the board 6 moves always crossing the surface of the polishing pad 10 in a slant direction and the abrasion of the polishing pad 10 becomes uniform. Consequently, the flatness of the mirror surface of the board 6 after polishing is substantially improved.
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CONSTITUTION:A printing circuit board 6 such as a silicon wafer is mounted to the/PCB mounting plate 5 of a rotary holder 3 and the board 6 is processed to a mirror surface with the polishing pad 10 of a rotary disc. In this case, when the rotary holder 3 rotates and the board 6 is positioned at the outermost side 6a and innermost side 6b, the board 6 does not contact the internal and external surfaces of the circular polishing pad 10. As a result, the board 6 moves always crossing the surface of the polishing pad 10 in a slant direction and the abrasion of the polishing pad 10 becomes uniform. 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CONSTITUTION:A printing circuit board 6 such as a silicon wafer is mounted to the/PCB mounting plate 5 of a rotary holder 3 and the board 6 is processed to a mirror surface with the polishing pad 10 of a rotary disc. In this case, when the rotary holder 3 rotates and the board 6 is positioned at the outermost side 6a and innermost side 6b, the board 6 does not contact the internal and external surfaces of the circular polishing pad 10. As a result, the board 6 moves always crossing the surface of the polishing pad 10 in a slant direction and the abrasion of the polishing pad 10 becomes uniform. 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CONSTITUTION:A printing circuit board 6 such as a silicon wafer is mounted to the/PCB mounting plate 5 of a rotary holder 3 and the board 6 is processed to a mirror surface with the polishing pad 10 of a rotary disc. In this case, when the rotary holder 3 rotates and the board 6 is positioned at the outermost side 6a and innermost side 6b, the board 6 does not contact the internal and external surfaces of the circular polishing pad 10. As a result, the board 6 moves always crossing the surface of the polishing pad 10 in a slant direction and the abrasion of the polishing pad 10 becomes uniform. Consequently, the flatness of the mirror surface of the board 6 after polishing is substantially improved.</abstract><oa>free_for_read</oa></addata></record>
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subjects DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
title POLISHING DEVICE FOR PRINTING CIRCUIT BOARD
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