ELECTRONIC PART
PURPOSE:To form a circuit having an active region without using a chip by forming a nucleation surface having an area sufficiently small for crystal growth only from a single nucleus onto a substrate consisting of a non-nucleation surface and growing a crystal composed of the single nucleus to the n...
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creator | SUGIMOTO TAICHI |
description | PURPOSE:To form a circuit having an active region without using a chip by forming a nucleation surface having an area sufficiently small for crystal growth only from a single nucleus onto a substrate consisting of a non-nucleation surface and growing a crystal composed of the single nucleus to the nucleation surface. CONSTITUTION:One part of a large area substrate 1 composed of alumina is wired by a conductor 2 made up of Mo, thus manufacturing an electronic part substrate. An SiO2 film 3 is deposited onto the substrate, said substrate 1 is set into a decompression vapor growth device, an Si3N4 layer is shaped onto the SiO2 layer 3, and an Si3N4 fine region 4 as a nucleation surface is formed through patterning. Consequently, when an Si single crystal is shaped onto the substrate 1, to the surface of which a non-nucleation surface composed of SiO2 and the nucleation surface consisting of Si3N4 are formed, through a thermal CVD method, the Si single crystal 5 is shaped centering around said Si3N4 region 4. A circuit including a diode transistor and a resistor is formed centering around the single crystal 5. Accordingly, the circuit having an active region can be shaped without using a chip. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPS6451652A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPS6451652A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPS6451652A3</originalsourceid><addsrcrecordid>eNrjZOB39XF1Dgny9_N0VghwDArhYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxXgHBZiamhmamRo7GRCgBALdkHSU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTRONIC PART</title><source>esp@cenet</source><creator>SUGIMOTO TAICHI</creator><creatorcontrib>SUGIMOTO TAICHI</creatorcontrib><description>PURPOSE:To form a circuit having an active region without using a chip by forming a nucleation surface having an area sufficiently small for crystal growth only from a single nucleus onto a substrate consisting of a non-nucleation surface and growing a crystal composed of the single nucleus to the nucleation surface. CONSTITUTION:One part of a large area substrate 1 composed of alumina is wired by a conductor 2 made up of Mo, thus manufacturing an electronic part substrate. An SiO2 film 3 is deposited onto the substrate, said substrate 1 is set into a decompression vapor growth device, an Si3N4 layer is shaped onto the SiO2 layer 3, and an Si3N4 fine region 4 as a nucleation surface is formed through patterning. Consequently, when an Si single crystal is shaped onto the substrate 1, to the surface of which a non-nucleation surface composed of SiO2 and the nucleation surface consisting of Si3N4 are formed, through a thermal CVD method, the Si single crystal 5 is shaped centering around said Si3N4 region 4. A circuit including a diode transistor and a resistor is formed centering around the single crystal 5. Accordingly, the circuit having an active region can be shaped without using a chip.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>1989</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19890227&DB=EPODOC&CC=JP&NR=S6451652A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19890227&DB=EPODOC&CC=JP&NR=S6451652A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUGIMOTO TAICHI</creatorcontrib><title>ELECTRONIC PART</title><description>PURPOSE:To form a circuit having an active region without using a chip by forming a nucleation surface having an area sufficiently small for crystal growth only from a single nucleus onto a substrate consisting of a non-nucleation surface and growing a crystal composed of the single nucleus to the nucleation surface. CONSTITUTION:One part of a large area substrate 1 composed of alumina is wired by a conductor 2 made up of Mo, thus manufacturing an electronic part substrate. An SiO2 film 3 is deposited onto the substrate, said substrate 1 is set into a decompression vapor growth device, an Si3N4 layer is shaped onto the SiO2 layer 3, and an Si3N4 fine region 4 as a nucleation surface is formed through patterning. Consequently, when an Si single crystal is shaped onto the substrate 1, to the surface of which a non-nucleation surface composed of SiO2 and the nucleation surface consisting of Si3N4 are formed, through a thermal CVD method, the Si single crystal 5 is shaped centering around said Si3N4 region 4. A circuit including a diode transistor and a resistor is formed centering around the single crystal 5. Accordingly, the circuit having an active region can be shaped without using a chip.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1989</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOB39XF1Dgny9_N0VghwDArhYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxXgHBZiamhmamRo7GRCgBALdkHSU</recordid><startdate>19890227</startdate><enddate>19890227</enddate><creator>SUGIMOTO TAICHI</creator><scope>EVB</scope></search><sort><creationdate>19890227</creationdate><title>ELECTRONIC PART</title><author>SUGIMOTO TAICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS6451652A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1989</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SUGIMOTO TAICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUGIMOTO TAICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC PART</title><date>1989-02-27</date><risdate>1989</risdate><abstract>PURPOSE:To form a circuit having an active region without using a chip by forming a nucleation surface having an area sufficiently small for crystal growth only from a single nucleus onto a substrate consisting of a non-nucleation surface and growing a crystal composed of the single nucleus to the nucleation surface. CONSTITUTION:One part of a large area substrate 1 composed of alumina is wired by a conductor 2 made up of Mo, thus manufacturing an electronic part substrate. An SiO2 film 3 is deposited onto the substrate, said substrate 1 is set into a decompression vapor growth device, an Si3N4 layer is shaped onto the SiO2 layer 3, and an Si3N4 fine region 4 as a nucleation surface is formed through patterning. Consequently, when an Si single crystal is shaped onto the substrate 1, to the surface of which a non-nucleation surface composed of SiO2 and the nucleation surface consisting of Si3N4 are formed, through a thermal CVD method, the Si single crystal 5 is shaped centering around said Si3N4 region 4. A circuit including a diode transistor and a resistor is formed centering around the single crystal 5. Accordingly, the circuit having an active region can be shaped without using a chip.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | ELECTRONIC PART |
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