MANUFACTURE OF MULTILAYERED PRINTED WIRING BOARD

PURPOSE:To obtain a multilayered printed wiring board which is normal and has a flat surface by a method wherein a molding pressure is kept high at a prescribed point until a resin of a glass cloth basic material prepreg starts to be fluidized and then kept low at a prescribed point after the materi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WATANABE SHINNOSUKE, TAKABAYASHI KOJI, NAKAMURA TOSHIO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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