THERMAL HEAD

PURPOSE:To make a device smaller in size and enhance performance or reliability, by a construction wherein at least a part of the side of a substrate opposite to the side on which heat generating resistors with a radiating support plate joined thereto is provided is made to be a slant surface, and is so ground as to leave an abrasion-resistant material layer. CONSTITUTION:A thermal head is so constructed that a semiconductor element 5 is driven by a driving current supplied through a connecting pin 14 to selectively cause heat generating resistors 4A to generate heat, thereby performing thermal recording on the side of the back surface 1b of a substrate 1, namely, on the side of a back surface 3b of an abrasion-resistant material layer 3. An oxidation-resisting layer 6 consisting of Si3N4, SiO2 or the like is provided on the heat generating resistors 4 contributing to thermal printing and on electrodes 13 for transmitting an external signal, and a radiating support plate 15 is joined thereon in a body through an adhesive layer 7 of a low melting point glass or the like provided on the layer 6. The adhesive layer 7 functions not only for adhesion but as a conventional glaze layer.