HANDLING DEVICE FOR WAFER
PURPOSE:To cool a wafer without deteriorating operating efficiency by providing a holding section holding the wafer with a cooling means supplying the wafer under a held state with a cooling fluid. CONSTITUTION:When a semiconductor wafer 2 is treated completely by a resist removing device, the surfa...
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| creator | SUGIMORI MASAHIRO OOSAKAYA TAKAYOSHI |
| description | PURPOSE:To cool a wafer without deteriorating operating efficiency by providing a holding section holding the wafer with a cooling means supplying the wafer under a held state with a cooling fluid. CONSTITUTION:When a semiconductor wafer 2 is treated completely by a resist removing device, the surface on the side reverse to a circuit forming surface is brought to a sucked state by a vacuum suction port 6 for a handling arm 5 and taken out. The spray of a cooling fluid 13 consisting of an inert gas is started from fluid spray ports 12a, 12b at the same time as vacuum suction at that time, and the cooling fluid flows in the directions of predetermined peripheral sections E1, E2 along the adsorbing surface of the wafer 2, thus cooling the semiconductor wafer 2. Accordingly, the semiconductor wafer 2 can be cooled efficiently on wafer handling. |
| format | Patent |
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CONSTITUTION:When a semiconductor wafer 2 is treated completely by a resist removing device, the surface on the side reverse to a circuit forming surface is brought to a sucked state by a vacuum suction port 6 for a handling arm 5 and taken out. The spray of a cooling fluid 13 consisting of an inert gas is started from fluid spray ports 12a, 12b at the same time as vacuum suction at that time, and the cooling fluid flows in the directions of predetermined peripheral sections E1, E2 along the adsorbing surface of the wafer 2, thus cooling the semiconductor wafer 2. 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CONSTITUTION:When a semiconductor wafer 2 is treated completely by a resist removing device, the surface on the side reverse to a circuit forming surface is brought to a sucked state by a vacuum suction port 6 for a handling arm 5 and taken out. The spray of a cooling fluid 13 consisting of an inert gas is started from fluid spray ports 12a, 12b at the same time as vacuum suction at that time, and the cooling fluid flows in the directions of predetermined peripheral sections E1, E2 along the adsorbing surface of the wafer 2, thus cooling the semiconductor wafer 2. Accordingly, the semiconductor wafer 2 can be cooled efficiently on wafer handling.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING |
| title | HANDLING DEVICE FOR WAFER |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-20T13%3A20%3A00IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SUGIMORI%20MASAHIRO&rft.date=1988-04-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPS6378546A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |