LAMINATE OF METALLIC BASE
PURPOSE:To increase the adhesion strength of the plating of a through hole by incorporating a base material in the adhesive resin layer between metallic sheets. CONSTITUTION:While each metallic sheet 2 is laminated in the state where through holes 1 coincide up and down through an adhesive resin she...
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| creator | FUKUSHIMA MUNEHIKO KANO TAKESHI |
| description | PURPOSE:To increase the adhesion strength of the plating of a through hole by incorporating a base material in the adhesive resin layer between metallic sheets. CONSTITUTION:While each metallic sheet 2 is laminated in the state where through holes 1 coincide up and down through an adhesive resin sheet 10 in which a base member 7 is incorporated, metallic foils 12 are lapped on the other periphery of the metallic sheet 2 on the outer periphery through an adhesive resin sheet 11, and laminating adhesion is carried out by compression forming under heating. Then, the resin 4 contained in the sheets 10, 11 flows out, and the through holes 1 are filled therewith. Next, a through hole 5 is bored in the part of the resin 4, and the base material 7 is exposed to the inner peripheral surface of the through hole 5. Then, while the plating 6 of the through hole is applied onto the inner peripheral surface of the hole 5, a circuit 14 is formed by etching the metallic foil 12. Then a part of the solution for plating soaks into an adhesive resin layer 3 a little along the base material 7 from the inner periphery of the hole 5. The part 6a of the plating 6 intrudes into the adhesive resin layer 3, and the adhesion strength of the through hole- plating to the inner surface of the hole 5 is increased. |
| format | Patent |
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CONSTITUTION:While each metallic sheet 2 is laminated in the state where through holes 1 coincide up and down through an adhesive resin sheet 10 in which a base member 7 is incorporated, metallic foils 12 are lapped on the other periphery of the metallic sheet 2 on the outer periphery through an adhesive resin sheet 11, and laminating adhesion is carried out by compression forming under heating. Then, the resin 4 contained in the sheets 10, 11 flows out, and the through holes 1 are filled therewith. Next, a through hole 5 is bored in the part of the resin 4, and the base material 7 is exposed to the inner peripheral surface of the through hole 5. Then, while the plating 6 of the through hole is applied onto the inner peripheral surface of the hole 5, a circuit 14 is formed by etching the metallic foil 12. Then a part of the solution for plating soaks into an adhesive resin layer 3 a little along the base material 7 from the inner periphery of the hole 5. The part 6a of the plating 6 intrudes into the adhesive resin layer 3, and the adhesion strength of the through hole- plating to the inner surface of the hole 5 is increased.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; TRANSPORTING</subject><creationdate>1988</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19881220&DB=EPODOC&CC=JP&NR=S63312139A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19881220&DB=EPODOC&CC=JP&NR=S63312139A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUKUSHIMA MUNEHIKO</creatorcontrib><creatorcontrib>KANO TAKESHI</creatorcontrib><title>LAMINATE OF METALLIC BASE</title><description>PURPOSE:To increase the adhesion strength of the plating of a through hole by incorporating a base material in the adhesive resin layer between metallic sheets. CONSTITUTION:While each metallic sheet 2 is laminated in the state where through holes 1 coincide up and down through an adhesive resin sheet 10 in which a base member 7 is incorporated, metallic foils 12 are lapped on the other periphery of the metallic sheet 2 on the outer periphery through an adhesive resin sheet 11, and laminating adhesion is carried out by compression forming under heating. Then, the resin 4 contained in the sheets 10, 11 flows out, and the through holes 1 are filled therewith. Next, a through hole 5 is bored in the part of the resin 4, and the base material 7 is exposed to the inner peripheral surface of the through hole 5. Then, while the plating 6 of the through hole is applied onto the inner peripheral surface of the hole 5, a circuit 14 is formed by etching the metallic foil 12. Then a part of the solution for plating soaks into an adhesive resin layer 3 a little along the base material 7 from the inner periphery of the hole 5. The part 6a of the plating 6 intrudes into the adhesive resin layer 3, and the adhesion strength of the through hole- plating to the inner surface of the hole 5 is increased.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1988</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD0cfT19HMMcVXwd1PwdQ1x9PHxdFZwcgx25WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8V4BwWbGxoZGhsaWjsbEqAEA_Jsf9g</recordid><startdate>19881220</startdate><enddate>19881220</enddate><creator>FUKUSHIMA MUNEHIKO</creator><creator>KANO TAKESHI</creator><scope>EVB</scope></search><sort><creationdate>19881220</creationdate><title>LAMINATE OF METALLIC BASE</title><author>FUKUSHIMA MUNEHIKO ; KANO TAKESHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS63312139A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1988</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>FUKUSHIMA MUNEHIKO</creatorcontrib><creatorcontrib>KANO TAKESHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUKUSHIMA MUNEHIKO</au><au>KANO TAKESHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LAMINATE OF METALLIC BASE</title><date>1988-12-20</date><risdate>1988</risdate><abstract>PURPOSE:To increase the adhesion strength of the plating of a through hole by incorporating a base material in the adhesive resin layer between metallic sheets. CONSTITUTION:While each metallic sheet 2 is laminated in the state where through holes 1 coincide up and down through an adhesive resin sheet 10 in which a base member 7 is incorporated, metallic foils 12 are lapped on the other periphery of the metallic sheet 2 on the outer periphery through an adhesive resin sheet 11, and laminating adhesion is carried out by compression forming under heating. Then, the resin 4 contained in the sheets 10, 11 flows out, and the through holes 1 are filled therewith. Next, a through hole 5 is bored in the part of the resin 4, and the base material 7 is exposed to the inner peripheral surface of the through hole 5. Then, while the plating 6 of the through hole is applied onto the inner peripheral surface of the hole 5, a circuit 14 is formed by etching the metallic foil 12. Then a part of the solution for plating soaks into an adhesive resin layer 3 a little along the base material 7 from the inner periphery of the hole 5. The part 6a of the plating 6 intrudes into the adhesive resin layer 3, and the adhesion strength of the through hole- plating to the inner surface of the hole 5 is increased.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING |
| title | LAMINATE OF METALLIC BASE |
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