ASSEMBLY DEVICE

PURPOSE:To make it possible to detect early a defect position in an assembly device adapted to be used for manufacturing a semiconductor device, by comparing the condition of a sensor during operation with the condition of the same when it is at an operation reference position so as to self-diagnose...

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1. Verfasser: TABATA KATSUHIRO
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Sprache:eng
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creator TABATA KATSUHIRO
description PURPOSE:To make it possible to detect early a defect position in an assembly device adapted to be used for manufacturing a semiconductor device, by comparing the condition of a sensor during operation with the condition of the same when it is at an operation reference position so as to self-diagnose the operating condition of the device. CONSTITUTION:In a condition in which the entire device normally operates, the operation is detected by sensors A, B, C, at the respective positions of the latter with a predetermined cycle period. If the sensor A arranged lateral of a disc 6 fails so that the sensor A does not operate even though the disc 6 is located at the original position, a control section 17 reads the conditions of the sensors A, B, C at the original point which are previously stored in memory. That is, at the original point, the conditions of the sensors A, B, C should be such that the sensor 4 lateral of the disc 6 is in its detecting condition while the sensor B at one of movable jigs 15 is in its detecting condition, and the sensor C at the other movable jig 15 is in an undetecting condition. Accordingly, the control section judges that either the sensor A or a motor 3 fails, and displays the defect position.
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CONSTITUTION:In a condition in which the entire device normally operates, the operation is detected by sensors A, B, C, at the respective positions of the latter with a predetermined cycle period. If the sensor A arranged lateral of a disc 6 fails so that the sensor A does not operate even though the disc 6 is located at the original position, a control section 17 reads the conditions of the sensors A, B, C at the original point which are previously stored in memory. That is, at the original point, the conditions of the sensors A, B, C should be such that the sensor 4 lateral of the disc 6 is in its detecting condition while the sensor B at one of movable jigs 15 is in its detecting condition, and the sensor C at the other movable jig 15 is in an undetecting condition. Accordingly, the control section judges that either the sensor A or a motor 3 fails, and displays the defect position.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT ; COMBINED OPERATIONS ; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; OTHER WORKING OF METAL ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; UNIVERSAL MACHINE TOOLS</subject><creationdate>1988</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19881024&amp;DB=EPODOC&amp;CC=JP&amp;NR=S63256320A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19881024&amp;DB=EPODOC&amp;CC=JP&amp;NR=S63256320A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TABATA KATSUHIRO</creatorcontrib><title>ASSEMBLY DEVICE</title><description>PURPOSE:To make it possible to detect early a defect position in an assembly device adapted to be used for manufacturing a semiconductor device, by comparing the condition of a sensor during operation with the condition of the same when it is at an operation reference position so as to self-diagnose the operating condition of the device. CONSTITUTION:In a condition in which the entire device normally operates, the operation is detected by sensors A, B, C, at the respective positions of the latter with a predetermined cycle period. If the sensor A arranged lateral of a disc 6 fails so that the sensor A does not operate even though the disc 6 is located at the original position, a control section 17 reads the conditions of the sensors A, B, C at the original point which are previously stored in memory. That is, at the original point, the conditions of the sensors A, B, C should be such that the sensor 4 lateral of the disc 6 is in its detecting condition while the sensor B at one of movable jigs 15 is in its detecting condition, and the sensor C at the other movable jig 15 is in an undetecting condition. 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CONSTITUTION:In a condition in which the entire device normally operates, the operation is detected by sensors A, B, C, at the respective positions of the latter with a predetermined cycle period. If the sensor A arranged lateral of a disc 6 fails so that the sensor A does not operate even though the disc 6 is located at the original position, a control section 17 reads the conditions of the sensors A, B, C at the original point which are previously stored in memory. That is, at the original point, the conditions of the sensors A, B, C should be such that the sensor 4 lateral of the disc 6 is in its detecting condition while the sensor B at one of movable jigs 15 is in its detecting condition, and the sensor C at the other movable jig 15 is in an undetecting condition. Accordingly, the control section judges that either the sensor A or a motor 3 fails, and displays the defect position.</abstract><oa>free_for_read</oa></addata></record>
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recordid cdi_epo_espacenet_JPS63256320A
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subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT
COMBINED OPERATIONS
DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
OTHER WORKING OF METAL
PERFORMING OPERATIONS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
TRANSPORTING
UNIVERSAL MACHINE TOOLS
title ASSEMBLY DEVICE
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