METHOD OF FORMING RESISTOR PROTECTING FILM OF HYBRID INTEGRATED CIRCUIT
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | MORIKAWA YOSHINORI |
| description | |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPS63155688A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPS63155688A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPS63155688A3</originalsourceid><addsrcrecordid>eNrjZHD3dQ3x8HdR8HdTcPMP8vX0c1cIcg32DA7xD1IICPIPcXUOAYm5efr4gtR4RDoFebooePqFuLoHOYa4uig4ewY5h3qG8DCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSSeK-AYDNjQ1NTMwsLR2Ni1AAA8TktFQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD OF FORMING RESISTOR PROTECTING FILM OF HYBRID INTEGRATED CIRCUIT</title><source>esp@cenet</source><creator>MORIKAWA YOSHINORI</creator><creatorcontrib>MORIKAWA YOSHINORI</creatorcontrib><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; RESISTORS ; SEMICONDUCTOR DEVICES</subject><creationdate>1988</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19880628&DB=EPODOC&CC=JP&NR=S63155688A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19880628&DB=EPODOC&CC=JP&NR=S63155688A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MORIKAWA YOSHINORI</creatorcontrib><title>METHOD OF FORMING RESISTOR PROTECTING FILM OF HYBRID INTEGRATED CIRCUIT</title><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>RESISTORS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1988</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD3dQ3x8HdR8HdTcPMP8vX0c1cIcg32DA7xD1IICPIPcXUOAYm5efr4gtR4RDoFebooePqFuLoHOYa4uig4ewY5h3qG8DCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSSeK-AYDNjQ1NTMwsLR2Ni1AAA8TktFQ</recordid><startdate>19880628</startdate><enddate>19880628</enddate><creator>MORIKAWA YOSHINORI</creator><scope>EVB</scope></search><sort><creationdate>19880628</creationdate><title>METHOD OF FORMING RESISTOR PROTECTING FILM OF HYBRID INTEGRATED CIRCUIT</title><author>MORIKAWA YOSHINORI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS63155688A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1988</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>RESISTORS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MORIKAWA YOSHINORI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MORIKAWA YOSHINORI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF FORMING RESISTOR PROTECTING FILM OF HYBRID INTEGRATED CIRCUIT</title><date>1988-06-28</date><risdate>1988</risdate><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JPS63155688A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESISTORS SEMICONDUCTOR DEVICES |
| title | METHOD OF FORMING RESISTOR PROTECTING FILM OF HYBRID INTEGRATED CIRCUIT |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-05T22%3A22%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MORIKAWA%20YOSHINORI&rft.date=1988-06-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPS63155688A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |