WAFER HOLDING MECHANISM

PURPOSE:To make a wafer attachable or detachable to or from a holder in a vacuum suction system as well as to secure such one that has no swell or dent causing an appearance failure, by attaching an elastic film to the wafer, and forming a vacuum suction hole of a holding member in an edge of the ho...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	AKAMATSU KIYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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