WAFER HOLDING MECHANISM

WAFER HOLDING MECHANISM

PURPOSE:To make a wafer attachable or detachable to or from a holder in a vacuum suction system as well as to secure such one that has no swell or dent causing an appearance failure, by attaching an elastic film to the wafer, and forming a vacuum suction hole of a holding member in an edge of the ho...

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1. Verfasser: AKAMATSU KIYOSHI
Format: Patent
Sprache:eng
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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creator AKAMATSU KIYOSHI
description PURPOSE:To make a wafer attachable or detachable to or from a holder in a vacuum suction system as well as to secure such one that has no swell or dent causing an appearance failure, by attaching an elastic film to the wafer, and forming a vacuum suction hole of a holding member in an edge of the holding member. CONSTITUTION:An elastic film 5 is attached to a wafer 4, and a vacuum suction hole part 2 of a holding member 1 is formed in an edge of the holding member 1. Therefore, the wafer 4 and the elastic film 5 are unitized in one, and since vacuum suction takes place between the elastic film 5 and the holding member 1, such dangerousness as sucking in an abrasive solution is limitable to only a space between the elastic film 5 and the holding member 1, thus the abrasive solution is preventable from sticking to the holding surface side of the wafer 4. In addition, since a gas-liquid flow between the elastic film 5 and the holding member 1 can be changed to an effusion flow ranging from the central part to the edge, the abrasive solution can be prevented from sticking to the holding member 1. Accordingly, the wafer 4 is detachable with a vacuum suction system, thus the wafer 4 that has no swell or dent causing an appearance failure is securable.
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CONSTITUTION:An elastic film 5 is attached to a wafer 4, and a vacuum suction hole part 2 of a holding member 1 is formed in an edge of the holding member 1. Therefore, the wafer 4 and the elastic film 5 are unitized in one, and since vacuum suction takes place between the elastic film 5 and the holding member 1, such dangerousness as sucking in an abrasive solution is limitable to only a space between the elastic film 5 and the holding member 1, thus the abrasive solution is preventable from sticking to the holding surface side of the wafer 4. In addition, since a gas-liquid flow between the elastic film 5 and the holding member 1 can be changed to an effusion flow ranging from the central part to the edge, the abrasive solution can be prevented from sticking to the holding member 1. 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CONSTITUTION:An elastic film 5 is attached to a wafer 4, and a vacuum suction hole part 2 of a holding member 1 is formed in an edge of the holding member 1. Therefore, the wafer 4 and the elastic film 5 are unitized in one, and since vacuum suction takes place between the elastic film 5 and the holding member 1, such dangerousness as sucking in an abrasive solution is limitable to only a space between the elastic film 5 and the holding member 1, thus the abrasive solution is preventable from sticking to the holding surface side of the wafer 4. In addition, since a gas-liquid flow between the elastic film 5 and the holding member 1 can be changed to an effusion flow ranging from the central part to the edge, the abrasive solution can be prevented from sticking to the holding member 1. 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CONSTITUTION:An elastic film 5 is attached to a wafer 4, and a vacuum suction hole part 2 of a holding member 1 is formed in an edge of the holding member 1. Therefore, the wafer 4 and the elastic film 5 are unitized in one, and since vacuum suction takes place between the elastic film 5 and the holding member 1, such dangerousness as sucking in an abrasive solution is limitable to only a space between the elastic film 5 and the holding member 1, thus the abrasive solution is preventable from sticking to the holding surface side of the wafer 4. In addition, since a gas-liquid flow between the elastic film 5 and the holding member 1 can be changed to an effusion flow ranging from the central part to the edge, the abrasive solution can be prevented from sticking to the holding member 1. Accordingly, the wafer 4 is detachable with a vacuum suction system, thus the wafer 4 that has no swell or dent causing an appearance failure is securable.</abstract><oa>free_for_read</oa></addata></record>
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subjects DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
title WAFER HOLDING MECHANISM
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