SURFACE ACOUSTIC WAVE DEVICE

SURFACE ACOUSTIC WAVE DEVICE

PURPOSE:To protect the chip surface with a film tape by arranging the film tape formed with a pattern on a surface acoustic wave chip while the pattern of the film tape is placed downward and bonding the film by ultrasonic wave. CONSTITUTION:The film tape in which a bonding pad 14 and a wiring patte...

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Hauptverfasser: TAKAI TERUO, WAKAMORI SATOSHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
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creator TAKAI TERUO
WAKAMORI SATOSHI
description PURPOSE:To protect the chip surface with a film tape by arranging the film tape formed with a pattern on a surface acoustic wave chip while the pattern of the film tape is placed downward and bonding the film by ultrasonic wave. CONSTITUTION:The film tape in which a bonding pad 14 and a wiring pattern 15 are formed on the surface of a plastic film 13 made of polyamide is arranged on the surface wave chip where an input electrode 11, an output electrode 12 and a sound absorbing member 10 to suppress an end face reflecting wave are formed on the surface of the piezoelectric base 1 and the input/output electrodes 11, 12 and the bonding pad 14 are bonded by ultrasonic wave. Through the structure above, the surface of base is protected by the film 13 and a high reliability surface acoustic wave filter not affected by a foreign adhered material is obtained.
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subjects BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
title SURFACE ACOUSTIC WAVE DEVICE
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